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Liao, Kuo-Wei
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1

Integrated High Aspect Ratio 3D High Density Capacitor in S..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lu, Chun-Lin ; Ho, Cheng-Shu ; Liu, Kuo-Wei... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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2

Reliability and Safety Assessment of Automated Driving Syst..:

, In: 2020 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM),
Wu, Kuo-Wei ; Liao, Chung-Chih ; Wu, Wen-Fang - p. 390-394 , 2020
Link: https://doi.org/10.1109/..
 
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3

Design and Implementation of SiC-Based Wide Input Voltage R..:

, In: 2019 IEEE 4th International Future Energy Electronics Conference (IFEEC),
Pan, Ciao-Yin ; Liang, Tsorng-Juu ; Tseng, Wei-Jing... - p. 1-8 , 2019
Link: https://doi.org/10.1109/..
 
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4

Characteristics of Power Module with New Advanced Substrate:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hsu, Hao Chiang ; Cheng, Lu-Ken ; Chi, Wei-Hao. - p. 243-246 , 2020
Link: https://doi.org/10.1109/..
 
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5

Power Cycle Reliability of Power Module with Different Sold..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lu, Ken-Cheng ; Guo, Siao-Wei ; Chen, Hao-Chih.. - p. 109-111 , 2020
Link: https://doi.org/10.1109/..
 
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6

Epoxy Resin Encapsulated IGBT Module Characteristics and Re..:

, In: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Yu-Ju ; Chen, Hao-Chih ; Chi, Wei-Hao... - p. 120-123 , 2019
Link: https://doi.org/10.1109/..
 
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7

Gradient Linear Model for Chroma Intra Prediction:

, In: 2023 Data Compression Conference (DCC),
Kuo, Che-Wei ; Li, Xinwei ; Xiu, Xiaoyu... - p. 13-21 , 2023
Link: https://doi.org/10.1109/..
 
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8

On enduring more data through enabling page rewrite capabil..:

, In: Proceedings of the 37th ACM/SIGAPP Symposium on Applied Computing,
Chang, Yu-Ming ; Ho, Chien-Chung ; Tsao, Che-Wei... - p. 107-115 , 2022
Link: https://dl.acm.org/doi/1..
 
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9

AIGO: A comprehensive platform for cultivating AI talent us..:

, In: 2019 IEEE International Conference on Engineering, Technology and Education (TALE),
Kuo, Chia-Wei ; Yang, Hai-Ling ; Liao, Hsien-Cheng... - p. 1-5 , 2019
Link: https://doi.org/10.1109/..
 
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10

Support of Android lab modules for embedded system curricul..:

, In: Proceedings of the 2010 Workshop on Embedded Systems Education,
Wang, Meng-Ting ; Huang, Po-Chun ; Lee, Jenq-Kuen... - p. 1-8 , 2010
Link: https://dl.acm.org/doi/1..
 
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11

Development of Linearized Direct Power Control for Three-Ph..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Liao, Yi-Hung ; Kuo, Wei-Lun ; Yeh, Cheng-Wei. - p. 3462-3465 , 2024
Link: https://doi.org/10.1109/..
 
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12

Investment Concentration and Home Bias:

, In: Innovative Mobile and Internet Services in Ubiquitous Computing; Advances in Intelligent Systems and Computing,
Liao, Mei-Hua ; Kuo, Wei-Li ; Chan, Ya-Lan - p. 573-578 , 2020
Link: https://doi.org/10.1007/..
 
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13

ML-based Thermal Sensor Calibration by Bivariate Gaussian M..:

, In: 2019 32nd IEEE International System-on-Chip Conference (SOCC),
Kuo, Wei-Chien ; Liu, Li-Wei ; Liao, Yen-Chin. - p. 113-117 , 2019
Link: https://doi.org/10.1109/..
 
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14

A 3nm 256Mb SRAM in FinFET Technology with New Array Bankin..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Chang, Jonathan ; Chen, Yen-Huei ; Chan, Gary... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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15

Nano-scale and Atomistic-Scale Modeling of Advanced Materia..:

, In: Nano-Bio- Electronic, Photonic and MEMS Packaging,
Dai, Ruo Li ; Liao, Wei-Hsin ; Lin, Chun-Te.. - p. 555-577 , 2021
Link: https://doi.org/10.1007/..
 
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