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Lim, Boon-Leong
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1

The Law and Practice of Advance Directives and End-of-Life ..:

, In: Advance Directives Across Asia,
Kaur, Sharon ; Wang, Thomas Tan Hooi ; Yau, Jenny Ka Yan. - p. 174-190 , 2023
Link: https://doi.org/10.1017/..
 
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2

Transient Thermal Evaluation of SiC Chip Based Power Module..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Tang, Gongyue ; Yamamoto, Kazunori ; Wai, Leong Ching.. - p. 359-364 , 2020
Link: https://doi.org/10.1109/..
 
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3

Demonstration of Vertically Integrated POP using FOWLP Appr..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Chong, Ser Choong ; Wai Leong Ching, Eva ; Pei Siang, Sharon Lim.. - p. 873-878 , 2020
Link: https://doi.org/10.1109/..
 
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4

Control of Electrical and Calcium Alternans in a One-Dimens..:

, In: Communications in Computer and Information Science; Methods and Applications for Modeling and Simulation of Complex Systems,
Keong, Jin ; Lan, Boon Leong ; Lim, Einly.. - p. 441-451 , 2023
Link: https://doi.org/10.1007/..
 
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5

UAV Swarm Communication Reliability Prediction using Machin..:

, In: 2023 IEEE 8th International Conference on Recent Advances and Innovations in Engineering (ICRAIE),
Lim, Reuben Yaw Hui ; Lim, Joanne Mun Yee ; Lan, Boon Leong... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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6

Comprehensive Study on the Encapsulation for the Intelligen..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Lim, Simon Siak Boon ; Ching, Eva Wai Leong ; Yamamoto, Kazunori. - p. 555-559 , 2019
Link: https://doi.org/10.1109/..
 
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7

The Strategies of 3D Modelling in the QS Profession:

, In: Advances in Civil and Industrial Engineering; Handbook of Research on Inclusive and Innovative Architecture and the Built Environment,
Soon, Lam Tatt ; Goh, Hsien Shien ; Lim, Tze Shwan... - p. 22-37 , 2023
Link: https://doi.org/10.4018/..
 
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8

Thermal Analysis, Characterization and and Material Selecti..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Tang, Gongyue ; Wai, Leong Ching ; Boon Lim, Siak... - p. 2078-2085 , 2020
Link: https://doi.org/10.1109/..
 
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9

Power Module on Copper Lead Frame with Novel Sintering Past..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Wai, Leong Ching ; Yamamoto, Kazunori ; Boon, Simon Lim Siak. - p. 302-306 , 2020
Link: https://doi.org/10.1109/..
 
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10

Compact Folded Patch with Stretchable PDMS Substrate for On..:

, In: 2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT),
Lee, Yong-Hong ; Lim, Eng-Hock ; Ng, Wai-Hau... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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11

Complementary Planar Inverted-F Antennas (PIFAs) for On-Met..:

, In: 2019 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE),
Lee, Yong-Hong ; Lim, Eng-Hock ; Bong, Fwee-Leong.. - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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12

A Systematic Underfill Selection Methodology for Fine Pitch..:

, In: 2007 9th Electronics Packaging Technology Conference,
Ong, Xuefen ; Sohn, Dong Kyun ; Hsia, Liang Choo... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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13

Automated Prediction of Glasgow Outcome Scale for Traumatic..:

, In: 2014 22nd International Conference on Pattern Recognition,
Su, Bolan ; Dinh, Thien Anh ; Ambastha, Abhinit Kumar... - p. 3245-3250 , 2014
Link: https://doi.org/10.1109/..
 
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14

Comparative Analysis of Passive, Active, and Hybrid Cell Ba..:

, In: 2024 International Conference on Electronics, Information, and Communication (ICEIC),
Lim, Wu Cong ; Teo, Boon Chiat Terence ; Lim, Xian Yang.. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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15

Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packagin:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lianto, Prayudi ; Tan, Chin Wei ; Jie Peng, Qi... - p. 1126-1131 , 2020
Link: https://doi.org/10.1109/..
 
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