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Lim, Pei
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1

Exploring the Effectiveness of Ensemble Learning for Busine..:

, In: 2024 3rd International Conference on Digital Transformation and Applications (ICDXA),
Lim, Pei Ying ; Chin, Wan Yoke ; Kong, Yih Hern - p. 226-230 , 2024
Link: https://doi.org/10.1109/..
 
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2

Near Infrared Remote Sensing of Vegetation Encroachment at ..:

, In: Proceedings of the 12th International Conference on Robotics, Vision, Signal Processing and Power Applications; Lecture Notes in Electrical Engineering,
Lim, Pei Yu ; Bong, David ; Ting, Kung Chuang... - p. 507-513 , 2024
Link: https://doi.org/10.1007/..
 
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3

Taxol: Mechanisms of action against cancer, an update with ..:

, In: Paclitaxel,
Lim, Pei Tee ; Goh, Bey Hing ; Lee, Wai-Leng - p. 47-71 , 2022
Link: https://doi.org/10.1016/..
 
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4

Contributors:

, In: Paclitaxel,
Abou-Dahech, Mariam Sami ; Al-Tawaha, Abdel Rahman ; Ashby Jr, Charles R.... - p. xi-xiv , 2022
Link: https://doi.org/10.1016/..
 
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5

List of Contributors:

, In: Nanocarriers for Drug Delivery,
Abbasi, Amirali ; Almokdad, Aiah A. ; Amado, Sandra... - p. xix-xxiii , 2019
Link: https://doi.org/10.1016/..
 
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6

Polymeric Nanomaterials:

, In: Nanocarriers for Drug Delivery,
Moreno Raja, Miguel ; Lim, Pei Qi ; Wong, Yee Shan... - p. 557-653 , 2019
Link: https://doi.org/10.1016/..
 
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7

Low Temperature Material Discovery and Readiness for 1st Le..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lim, Sze Pei ; Tsuriya, Masahiro ; Gokhale, Shripad. - p. 61-62 , 2024
Link: https://doi.org/10.23919..
 
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8

An In-containing Lower-Temperature Lead-Free Solder Paste f..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Zhang, HongWen ; Lim, Sze Pei - p. 7-8 , 2023
Link: https://doi.org/10.23919..
 
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9

Exploring Maritime History through Digital Humanities: The ..:

, In: 2023 Pacific Neighborhood Consortium Annual Conference and Joint Meetings (PNC),
Lim, Chia Pei ; Chen, Chih-Ming ; Chang, Chung - p. 22-29 , 2023
Link: https://doi.org/10.23919..
 
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10

Low Temperature Material for 1st Level Interconnect in Semi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Lim, Sze Pei ; Arvin, Charles ; Sweatman, Keith. - p. 378-386 , 2022
Link: https://doi.org/10.1109/..
 
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11

A Drop-In High-Temperature Lead-Free Solder Paste that Outp..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Zhang, Hongwen ; Lim, Sze Pei ; Lytwynec, Samuel.. - p. 69-70 , 2022
Link: https://doi.org/10.23919..
 
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12

A Novel High-Temperature Pb-Free Solder Paste with Enhanced..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),
Zhang, Hongwen ; Lim, Sze Pei ; Lytwynec, Samuel... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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13

Yield Improvement in Chip to Wafer Hybrid Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Choong Chong, Ser ; Cereno Daniel, Ismael ; Lim Pei Siang, Sharon... - p. 1982-1986 , 2022
Link: https://doi.org/10.1109/..
 
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14

Low temperature interconnects in 1st level packaging and it..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Arvin, Charles ; Lim, Sze Pei ; Locker, David... - p. 7-8 , 2022
Link: https://doi.org/10.23919..
 
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15

Environmental impact of quantum dots:

, In: Graphene, Nanotubes and Quantum Dots-Based Nanotechnology,
Abu Bakar, Noor Fitrah ; Tan, Huey Ling ; Lim, Ying Pei.. - p. 837-867 , 2022
Link: https://doi.org/10.1016/..
 
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