Lim, Yvonne A L
10  results:
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1

Contributors:

, In: Comprehensive Guide to Hepatitis Advances,
Agarwal, Kosh ; Armandi, Angelo ; Berná, Genoveva... - p. xi-xiv , 2023
 
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2

The Effects of Voids on Solder Joint Reliability in First L..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lim, Sze Pei ; Lee, Kor Oon ; Oi, Kiyoshi... - p. 1-4 , 2022
 
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3

Voids in First-Level Interconnects and Their Impact on Sold..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Kor Oon ; Oi, Kiyoshi ; Lim, Sze Pei... - p. 5-6 , 2022
 
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4

Influence of micro voids in flip chip bump on electro-migra..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Murayama, Kei ; Oon Lee, Kor ; Ono, Toshiaki... - p. 1144-1152 , 2022
 
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5

Design of Virtual Reality Simulation-based Safety Training ..:

, In: 2019 IEEE International Symposium on Haptic, Audio and Visual Environments and Games (HAVE),
 
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6

Contributors:

, In: Translational Regenerative Medicine,
Abolbashari, Mehran ; Ahn, Jaimo ; Akel, Salem... - p. xvii-xx , 2015
 
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7

Contributors:

, In: Current Clinical Medicine,
Abdelmalak, Joseph B. ; Abelson, Abby ; Absi, Ahmed... - p. vii-viii , 2010
 
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9

Finger talk : collaborative decision-making using talk a..:

, In: CHI '04 Extended Abstracts on Human Factors in Computing Systems,
Rogers, Yvonne ; Hazlewood, William ; Blevis, Eli. - p. 1271-1274 , 2004
 
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10

Tuklas: Design, Development and Testing of an Augmented Rea..:

, In: 2019 IEEE International Conference on Engineering, Technology and Education (TALE),
 
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