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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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The Effects of Voids on Solder Joint Reliability in First L..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Voids in First-Level Interconnects and Their Impact on Sold..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Influence of micro voids in flip chip bump on electro-migra..:
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2019 IEEE International Symposium on Haptic, Audio and Visual Environments and Games (HAVE) ,
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Design of Virtual Reality Simulation-based Safety Training ..:
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CHI '04 Extended Abstracts on Human Factors in Computing Systems ,
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Finger talk : collaborative decision-making using talk a..:
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2019 IEEE International Conference on Engineering, Technology and Education (TALE) ,
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