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IECON 2007 - 33rd Annual Conference of the IEEE Industrial Electronics Society ,
1
A Novel and Efficient Immunoassay: Using Electro-Microchip,..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
2
Analysis of Seismic Response Characteristics of Coal-Bearin..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
3
Sedimentary Responses to Subsalt Tectonic Evolution in the ..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
4
Characteristics and Mechanism of Formation of Dolomite Rese..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
5
A Novel Study on Classification Method of Complex Carbonate..:
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2023 International Electron Devices Meeting (IEDM) ,
6
First BEOL-compatible, 10 ns-fast, and Durable 55 nm Top-pS..:
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2023 20th China International Forum on Solid State Lighting & 2023 9th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS) ,
7
Optimization of Heteroepitaxial Gallium Oxide Thin Films on..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022 ,
8
Rock Physical Analysis of Middle and Lower Jurassic Coal-Be..:
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2023 IEEE International Solid- State Circuits Conference (ISSCC) ,
9
VISTA: A 704mW 4K-UHD CNN Processor for Video and Image Spa..:
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2019 IEEE 8th Global Conference on Consumer Electronics (GCCE) ,
10
Study of Features and Number of Time Steps to Improve Hourl..:
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Proceedings of the Second IEEE/ACM International Conference on Connected Health: Applications, Systems and Engineering Technologies ,
11
A portable tool for eye fatigue detection:
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Proceedings of the 20th international conference on Parallel and distributed processing ,
12
Easy and reliable cluster management : the self-manageme..:
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2021 IEEE Far East NDT New Technology & Application Forum (FENDT) ,
13
Ultrasonic Nondestructive Testing Technology for Residual S..:
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2021 IEEE Far East NDT New Technology & Application Forum (FENDT) ,
14
Ultrasonic Evaluation of the Influence of Density on the Re..:
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2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) ,
15
Environmental Sensing Hub on Single Chip Using Double-Side ..:
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