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Proceedings of the 11th Annual Conference Companion on Genetic and Evolutionary Computation Conference: Late Breaking Papers ,
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Cancer classification using microarray and layered architec..:
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2023 Sixth International Symposium on Computer, Consumer and Control (IS3C) ,
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Effects of Chemical Displacing Time for the Characteristics..:
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Advances in Intelligent Systems and Computing; Web, Artificial Intelligence and Network Applications ,
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An Automatic Software Quality and Function Assurance Case S..:
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Advances in Intelligent Systems and Computing; Web, Artificial Intelligence and Network Applications ,
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The Case Study of Software Build-in Design Based on Quality..:
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2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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An Investigation of Plasma Charging Effect on FinFET Front-..:
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2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
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3D Stackable Via RRAM Cells by Cu BEOL Process in FinFET CM..:
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Proceedings of the 2nd International Conference on Biomedical Engineering and Bioinformatics ,
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Visualization of Time-to-Peak Changes on Cerebral Digital S..:
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2023 IEEE International Symposium on High-Performance Computer Architecture (HPCA) ,
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Tensor Movement Orchestration in Multi-GPU Training Systems:
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2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII) ,
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Multimodal Framework for Fake Messages Detection with Textu..:
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2022 International Electron Devices Meeting (IEDM) ,
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A New Self-Powered Wireless Sensing Circuitry for On-Wafer ..:
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2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC) ,
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PUMP: Profiling-free Unified Memory Prefetcher for Large DN..:
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2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ,
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Self-Inhibit Complementary Cells by High-κ Metal Gate Trans..:
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2020 IEEE International Solid- State Circuits Conference - (ISSCC) ,
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7.2 A 12nm Programmable Convolution-Efficient Neural-Proces..:
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Proceedings of the 2015 Conference on research in adaptive and convergent systems ,
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Thermal/performance characterization of CMPs with 3D-stacke..:
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Proceedings of the 2013 International Symposium on Low Power Electronics and Design ,
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