Lin, Ming-Yu
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1

Effects of In/Zn composition on the Performance of Ultra-th..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
 
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2

First Demonstration of Highly Scaled Atomic Layer Deposited..:

, In: 2023 International Electron Devices Meeting (IEDM),
Liang, Yan-Kui ; Zheng, Jun-Yang ; Lin, Yu-Lon... - p. 1-4 , 2023
 
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3

High-Endurance MoS2 FeFET with Operating Voltage Fess Than ..:

, In: 2023 International Electron Devices Meeting (IEDM),
 
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4

A New Transparent Planar Reflector Antennas for Satellite D..:

, In: 2019 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS),
Lin, Yu-Ming ; Li, Zong-Fu ; Tai, Tzu-Chun... - p. 1-2 , 2019
 
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5

Design of Graphic Dditor for the Alignments of Closed Conto..:

, In: Proceedings of the 2nd International Conference on Advances in Image Processing,
 
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6

Nanowires:

, In: Springer Handbook of Nanotechnology,
Dresselhaus, Mildred ; Lin, Yu-Ming ; Rabin, Oded... - p. 113-160 , 2007
 
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7

Web image annotation by fusing visual features and textual ..:

, In: Proceedings of the 2007 ACM symposium on Applied computing,
Tseng, Vincent. S. ; Su, Ja-Hwung ; Wang, Bo-Wen. - p. 1056-1060 , 2007
 
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8

Research on the application of 3D scanning and 3D printing ..:

, In: Proceedings of the 2019 International Conference on Robotics, Intelligent Control and Artificial Intelligence,
Jian-yin, Tang ; Zhe, Zhang ; Ming-yu, Lin... - p. 268-271 , 2019
 
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9

Retraining-free Constraint-aware Token Pruning for Vision T..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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10

Conducted Emission Simulation with ICEM Modeling and Measur..:

, In: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa),
Liao, Ren-Hui ; Lin, Han-Nien ; Ho, Tzu-Hao... - p. 631-634 , 2024
 
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11

Similarity-Aware Fast Low-Rank Decomposition Framework for ..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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12

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Eng..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Shih, Ming-En ; Hsieh, Shih-Wei ; Tsai, Ping-Yuan... - p. 360-362 , 2024
 
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13

A 40nm 24.6TOPS/W Scalable EfficientDet Processor for Objec..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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14

GenUSD: 3D scene generation made easy:

, In: ACM SIGGRAPH 2024 Real-Time Live!,
Lin, Tsung-Yi ; Lin, Chen-Hsuan ; Cui, Yin... - p. 1-2 , 2024
 
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15

Magic3D: High-Resolution Text-to-3D Content Creation:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Lin, Chen-Hsuan ; Gao, Jun ; Tang, Luming... - p. 300-309 , 2023
 
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