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202020 3rd IEEE International Conference on Knowledge Innovation and Invention (ICKII) ,
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Robust Multi-Class Classification Using Linearly Scored Cat..:
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2024 10th International Conference on Applied System Innovation (ICASI) ,
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Efficient Semantic Segmentation of Optical Coherence Tomogr..:
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2023 Asia-Pacific Microwave Conference (APMC) ,
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Magnetic-Free Radio Frequency Circulators Using Bulk Acoust..:
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2023 IEEE International Ultrasonics Symposium (IUS) ,
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Improved Ultrasound Attenuation Coefficient Estimation Usin..:
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2022 12th Workshop on Hyperspectral Imaging and Signal Processing: Evolution in Remote Sensing (WHISPERS) ,
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A Fast Multidimensional Data Fusion Algorithm For Hyperspec..:
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2022 IEEE International Conference on Consumer Electronics - Taiwan ,
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Data Augmentation Method For Fabric Defect Detection:
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2022 IEEE International Ultrasonics Symposium (IUS) ,
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CLA-U-Net: Convolutional Long-short-term-memory Attention-g..:
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2022 12th Workshop on Hyperspectral Imaging and Signal Processing: Evolution in Remote Sensing (WHISPERS) ,
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Hyperspectral Dehazing Using Admm-Adam Theory:
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2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
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Reconfigurable MAC Systolic Array Architecture Design for T..:
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Computer Vision – ACCV 2018; Lecture Notes in Computer Science ,
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Deep Semantic Matching with Foreground Detection and Cycle-..:
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Advances in Smart Vehicular Technology, Transportation, Communication and Applications; Smart Innovation, Systems and Technologies ,
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Evaluating Multi-dimensional Abilities of Bus Drivers:
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Proceedings of the Fifth International Conference on Network, Communication and Computing ,
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Design of Cameras Gateway for Remote Monitoring and Human T..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:
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ACM SIGGRAPH 2023 Immersive Pavilion ,
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