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Lin, Shih-Kang
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1

An Investigation of Cu/Ni/Ga Interfacial Reaction with Diff..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huang, Tzu-hsuan ; Huang, Jian-wei ; Lin, Zhih-feng. - p. 135-136 , 2024
Link: https://doi.org/10.23919..
 
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2

A machine learning approach to explore tensile properties o..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Liu, Yu-Chen ; Kholik, Ahmad ; Lin, Shih-Kang - p. 71-72 , 2023
Link: https://doi.org/10.23919..
 
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3

How to enhance Sn-Bi low-temperature solder by alloying?:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Lin, Shih-Kang ; Yang, Chih-Han ; Liu, Yu-Chen.. - p. 53-54 , 2023
Link: https://doi.org/10.23919..
 
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4

The Blech effect revisited – an in-situ study:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lin, Shih-kang ; Liu, Yu-chen ; Lin, Kuan-hsueh - p. 205-206 , 2022
Link: https://doi.org/10.23919..
 
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5

Sn-based solder design using machine learning approach:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Liu, Yu-Chen ; Yang, Chih-Han ; Lin, Shih-Kang - p. 43-44 , 2022
Link: https://doi.org/10.23919..
 
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6

Approach a UV-C LEDs Optical Modeling with Aid of Fluoresce..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Le, Thi-Thu-Ngoc ; Lin, Shih-Kang ; Sun, Ching-Cherng... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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7

Design of Matrix Light Source Applied to Small-Sized Headla..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Wu, Chi-Shou ; Lin, Shih-Kang ; Le, Thi-Thu-Ngoc... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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8

Mechanical properties of Sn-Bi-Ag low-temperature Pb-free s..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Yang, Chih-Han ; Liu, Yu-Chen ; Hirata, Yuki.. - p. 37-38 , 2022
Link: https://doi.org/10.23919..
 
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9

High thermal stability Cu-to-Cu joints fabricated by using ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Huang, Tzu-Hsuan ; Liu, Yu-Chen ; Cheng, Cheng-En... - p. 127-128 , 2022
Link: https://doi.org/10.23919..
 
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10

Enhancement of Lighting Quality for the Product of Phosphor..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Sun, Ching-Cherng ; Nguyen, Quang-Khoi ; Lee, Tsung-Xian... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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11

Effect of low Bi content on mechanical properties of Sn-Bi-..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
Nishikawa, Hiroshi ; Hirata, Yuki ; Yang, Chih-han. - p. 383-386 , 2022
Link: https://doi.org/10.1109/..
 
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12

Diversified Essential Properties in Transition Metal–Adsorb..:

, In: Green Energy Materials Handbook,
Tran, Ngoc Thanh Thuy ; Kuo, Chun-Hsien ; Pham, Hai Duong.. - p. 109-123 , 2019
Link: https://doi.org/10.1201/..
 
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13

Perspective on Battery Research:

, In: Green Energy Materials Handbook,
Nasara, Ralph Nicolai ; Tu, Chai-Hao ; Lin, Shih-Kang - p. 341-356 , 2019
Link: https://doi.org/10.1201/..
 
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14

Balancing Approach for Causal Inference at Scale:

, In: Proceedings of the 29th ACM SIGKDD Conference on Knowledge Discovery and Data Mining,
Lin, Sicheng ; Xu, Meng ; Zhang, Xi... - p. 4485-4496 , 2023
Link: https://dl.acm.org/doi/1..
 
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15

Stability Analysis of a Grid-Connected DC Microgrid with Hy..:

, In: 2023 IEEE Industry Applications Society Annual Meeting (IAS),
Wang, Li ; Lin, Shih-Chia ; Li, Ting-You... - p. 1-9 , 2023
Link: https://doi.org/10.1109/..
 
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