Lin, Wei-Feng
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1

Analysis of Three-Dimensional Thermocline Based on Argo Dat:

, In: 2018 OCEANS - MTS/IEEE Kobe Techno-Oceans (OTO),
Wang, Chong ; Zhao, Minghao ; Wang, Kai.. - p. 1-6 , 2018
 
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2

Room Acoustic Design for Open Plan Interior in Dwelling Hou..:

, In: Cross-Cultural Design; Lecture Notes in Computer Science,
Lin, Wei ; Huang, Chun-Pin ; Lu, Fei-Ran. - p. 72-87 , 2024
 
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3

An Investigation of Cu/Ni/Ga Interfacial Reaction with Diff..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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4

Machine Vision Observation, Artificial Intelligence Pattern..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Chen, Cheng-Shan ; Yang, Chun-Yen ; Yang, Shao-Jui... - p. 10B.5-1-10B.5-7 , 2024
 
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6

List of contributors:

, In: Joint and Bone,
Chen, Hongzhen ; Chen, Peng-Yu ; El-Hashash, Ahmed... - p. xiii-xv , 2023
 
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7

FPGA Design of RISC-V MCU Collaborative Industrial Printer ..:

, In: 2023 IEEE 6th International Conference on Knowledge Innovation and Invention (ICKII),
Yen, Mao-Hsu ; Lin, Tzu-Feng ; Tsou, Cheng-Hao... - p. 142-146 , 2023
 
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8

DM-MIMO Based GFDM Advanced Underwater Image Transmission S..:

, In: Springer Proceedings in Materials; Physics and Mechanics of New Materials and Their Applications,
Lin, Chin-Feng ; Wei, Yu-Chi ; Wen, Chai-Sheng... - p. 466-470 , 2023
 
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9

Restoration of Paleosedimentary Environment of Qingshankou ..:

, In: Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2022,
Lin, Tie-feng ; Fu, Xiu-li ; Cui, Kun-ning... - p. 6731-6746 , 2023
 
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10

A High Accuracy Full Vehicle Modeling Scheme with Air Suspe..:

, In: 2022 International Automatic Control Conference (CACS),
Hsu, Wei-Feng ; Lu, Po-Han ; Lin, Yu-Chen.. - p. 1-5 , 2022
 
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11

A Wireless Power Transmission System for Automated Guided V..:

, In: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA),
 
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12

Wide Range Output Voltage LLC Resonant Converter for Electr..:

, In: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA),
 
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13

High thermal stability Cu-to-Cu joints fabricated by using ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Huang, Tzu-Hsuan ; Liu, Yu-Chen ; Cheng, Cheng-En... - p. 127-128 , 2022
 
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14

Design and Implementation of Interleaved Hybrid Modulation ..:

, In: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA),
 
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15

Location Optimization of Service Centers for Seniors Based ..:

, In: Advances in Smart Vehicular Technology, Transportation, Communication and Applications; Smart Innovation, Systems and Technologies,
Wang, Wei-Feng ; Wang, Ruo-Bin ; Yin, Shuo.. - p. 249-256 , 2021
 
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