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Lin, Xiaochen
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1

900 MHz RF Power Rectifier Based on Ultra-low Turn-on Volta..:

, In: 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE),
Yu, Xiaochen ; Lin, Ya-Xun ; Mitrovic, Ivona Z.... - p. 441-444 , 2024
Link: https://doi.org/10.1109/..
 
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2

Disentangling ID and Modality Effects for Session-based Rec..:

, In: Proceedings of the 47th International ACM SIGIR Conference on Research and Development in Information Retrieval,
Zhang, Xiaokun ; Xu, Bo ; Ren, Zhaochun... - p. 1883-1892 , 2024
Link: https://dl.acm.org/doi/1..
 
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3

An Integrated Method for Day-ahead Photovoltaic Power Predi..:

, In: 2024 9th Asia Conference on Power and Electrical Engineering (ACPEE),
Lv, Kexin ; Miao, Xinhui ; Ye, Lin... - p. 1477-1483 , 2024
Link: https://doi.org/10.1109/..
 
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4

A Readout Integrated Circuit of Graphene-Silicon Charge-Sam..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wang, Xiaochen ; Lin, Jiangming ; Ning, Hao... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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5

Closed-Loop Test Scheme of Microcomputer Protection Based o..:

, In: 2024 IEEE 7th International Electrical and Energy Conference (CIEEC),
Shao, Xiaofei ; Cong, Wei ; Lv, Jing... - p. 1155-1160 , 2024
Link: https://doi.org/10.1109/..
 
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6

Distribution Network Topology Identification Based on Time ..:

, In: 2024 IEEE 7th International Electrical and Energy Conference (CIEEC),
Lin, Xiang ; Cong, Wei ; Diao, Chenyan... - p. 978-983 , 2024
Link: https://doi.org/10.1109/..
 
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7

Gated-Cross Aggregation Network for Hyperspectral and LiDAR..:

, In: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium,
Shi, Xiaochen ; Lin, Junyan ; Rao, Yuan.. - p. 1265-1268 , 2023
Link: https://doi.org/10.1109/..
 
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8

Study on mechanical properties and microstructure reliabili..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jiaxing ; Zhang, Long ; Yao, Quanbin... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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9

Effect of insulating material and structure on the reliabil..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Li, Zongyang ; Yao, Quanbin ; Lin, Pengrong... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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10

Approximate Simulation of Low Frequency Magnetic Shielding ..:

, In: Lecture Notes in Electrical Engineering; The Proceedings of the 17th Annual Conference of China Electrotechnical Society,
Sun, Zelai ; Dong, Wei ; Qin, Dingyu... - p. 501-508 , 2023
Link: https://doi.org/10.1007/..
 
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11

Study of flip ultrasonic bonding process with Non-conductiv..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Haoming ; Guo, Hengtong ; Xu, Shimeng... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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12

Engineering Compulsory Food Safety Liability Insurance in C..:

, In: Revolutionary Approach to International Law; International Law in Asia,
Zhang, Lin ; Zhang, Xiaochen - p. 301-320 , 2023
Link: https://doi.org/10.1007/..
 
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13

A Kind of Paradigm-Based Software Cost Estimation Method Us..:

, In: 2023 IEEE 3rd International Conference on Software Engineering and Artificial Intelligence (SEAI),
Zhu, Xiaolu ; Fu, Bin ; Lu, Yang.. - p. 22-27 , 2023
Link: https://doi.org/10.1109/..
 
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14

VERTEX: VEhicle Reconstruction and TEXture Estimation from ..:

, In: Artificial Intelligence; Lecture Notes in Computer Science,
Zhao, Xiaochen ; Zheng, Zerong ; Ji, Chaonan... - p. 634-646 , 2022
Link: https://doi.org/10.1007/..
 
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15

Transient liquid phase bonding of Sn-Pb solder with added N..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jiaxing ; Yao, Quanbin ; Lin, Pengrong... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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