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Liou, Li-Syue
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1

Solution Insight of Platform Printed Circuit Board Fiber-Wa..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lo, Hellen ; Lin, Chuck ; Syue, Jerry. - p. 01-04 , 2023
Link: https://doi.org/10.1109/..
 
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2

Problem of the Slot Connector Model Extraction by De-embedd..:

, In: 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI),
Lee, Scott ; Chuang, Eriksson ; Chang, William.. - p. 96-99 , 2020
Link: https://doi.org/10.1109/..
 
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Problem of the Slot Connector Model Extraction by De-embedd..:

, In: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
Lee, Scott ; Chuang, Eriksson ; Chang, William.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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4

0.18 µm BCD technology platform with best-in-class 6 V to 7..:

, In: 2012 24th International Symposium on Power Semiconductor Devices and ICs,
Chou, Hsueh-Liang ; Su, P. C. ; Ng, J. C. W.... - p. 401-404 , 2012
Link: https://doi.org/10.1109/..
 
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