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Liu, Daquan
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1

The Processing Technique of Direct Radio Digitalization and..:

, In: Lecture Notes in Electrical Engineering; Signal and Information Processing, Networking and Computers,
Qin, Mingnuan ; Liang, Zhen ; Su, Ben. - p. 251-258 , 2024
Link: https://doi.org/10.1007/..
 
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2

Deep Image-based Illumination Harmonization:

, In: 2022 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Bao, Zhongyun ; Long, Chengjiang ; Fu, Gang... - p. 18521-18530 , 2022
Link: https://doi.org/10.1109/..
 
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3

A Phase Calibration Free Method for Tri-band Ground TT&C An..:

, In: 2022 11th International Conference on Communications, Circuits and Systems (ICCCAS),
Yan, Yalong ; Li, Junyao ; Qin, Mingnuan. - p. 115-119 , 2022
Link: https://doi.org/10.1109/..
 
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4

ARShadowGAN: Shadow Generative Adversarial Network for Augm..:

, In: 2020 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Liu, Daquan ; Long, Chengjiang ; Zhang, Hongpan... - p. 8136-8145 , 2020
Link: https://doi.org/10.1109/..
 
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5

Analysis for Dual-Channel Tracking Receiver Phase Calibrati..:

, In: 2023 8th International Conference on Computer and Communication Systems (ICCCS),
Hongjun, Hu ; Daquan, Liu ; Yalong, Yan. - p. 617-622 , 2023
Link: https://doi.org/10.1109/..
 
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6

DiffFit: Unlocking Transferability of Large Diffusion Model..:

, In: 2023 IEEE/CVF International Conference on Computer Vision (ICCV),
Xie, Enze ; Yao, Lewei ; Shi, Han... - p. 4207-4216 , 2023
Link: https://doi.org/10.1109/..
 
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7

On-Chip Substrate Integrated Plasmonic Waveguide Bandpass F..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Yu, Tian ; Chen, Xin ; Zhou, Yaqing... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Completely Filling of Through-Silicon-Vias with High Aspect..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Wang, Manyu ; Li, Ke ; Bao, Shuchao... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Thermal Reliability Study of Si-based Chip Nanosilver Sinte..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Ma, Peng ; Gan, Guisheng ; Liu, Cong... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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10

A Simple and Effective Baseline for Robust Logo Detection:

, In: Proceedings of the 29th ACM International Conference on Multimedia,
Xu, Weipeng ; Liu, Ye ; Lin, Daquan - p. 4784-4788 , 2021
Link: https://dl.acm.org/doi/1..
 
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11

Effect of Rapid Thermal Fatigue on Microstructure and Prope..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Tian, Mizhe ; Gan, Guisheng ; Cao, Huadong... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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12

Development and Reliability study of 3D WLCSP for automotiv..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Ma, Shuying ; Liu, Yi ; Zheng, Fengxia... - p. 461-466 , 2020
Link: https://doi.org/10.1109/..
 
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13

Interfacial stress in Through Silicon Vias:

, In: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging,
Li, Wei ; Qin, Fei ; An, Tong... - p. 606-610 , 2012
Link: https://doi.org/10.1109/..
 
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14

Contributors:

, In: Raj's Practical Management of Pain,
Abrams, Bernard M. ; Apkarian, A.V. ; Argoff, Charles E.... - p. vii-xii , 2008
Link: https://doi.org/10.1016/..
 
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15

Investigating Testing Elasticity of Equivalent Material for..:

, In: 2005 IEEE Engineering in Medicine and Biology 27th Annual Conference,
Xie, Chi ; Liu, Nian ; Gao, Zhongyou.. - p. 5862,5863,5864 , 2005
Link: https://doi.org/10.1109/..
 
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