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Liu, Hsiao-Hsuan
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1

Emerging Interconnect Exploration for SRAM Application Usin..:

, In: 2023 24th International Symposium on Quality Electronic Design (ISQED),
Pei, Zhenlin ; Mayahinia, Mahta ; Liu, Hsiao-Hsuan... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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2

Technology/Memory Co-Design and Co-Optimization Using E-Tre..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2023,
Pei, Zhenlin ; Mayahinia, Mahta ; Liu, Hsiao-Hsuan... - p. 159-162 , 2023
Link: https://dl.acm.org/doi/1..
 
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3

Electromigration-aware design technology co-optimization fo..:

, In: 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Mayahinia, Mahta ; Liu, Hsiao-Hsuan ; Mishra, Subrat... - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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4

Infrared Response of Stacked GeSn Transistors:

, In: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Liu, Hsiao-Hsuan ; Huang, Yu-Shiang ; Lu, Fang-Liang.. - p. 100-101 , 2020
Link: https://doi.org/10.1109/..
 
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5

First Vertically Stacked Tensily Strained Ge0.98Si0.02 nGAA..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Tu, Chien-Te ; Huang, Yu-Shiang ; Lu, Fang-Liang... - p. 29.3.1-29.3.4 , 2019
Link: https://doi.org/10.1109/..
 
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6

Conversion from Dimensional Emotions to Discrete Emotions:

, In: HCI International 2024 Posters; Communications in Computer and Information Science,
Lin, Ray F. ; Hsiao, Ching-Wen ; Liu, Tzu-Hsuan - p. 296-303 , 2024
Link: https://doi.org/10.1007/..
 
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7

List of Contributors:

, In: Chemical, Gas, and Biosensors for Internet of Things and Related Applications,
Arakawa, Takahiro ; Bi, Hongmei ; Cheng, Chao-Min... - p. xv-xviii , 2019
Link: https://doi.org/10.1016/..
 
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8

Contributor contact details:

, In: Physical Properties and Applications of Polymer Nanocomposites,
Tjong, S.C. ; Mai, Yiu-Wing ; Cheng, Xinjian... - p. xv-xx , 2010
Link: https://doi.org/10.1016/..
 
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9

From the Perspective of High-Risk Leisure Environment: A St..:

, In: The 6th International Symposium on Water Resource and Environmental Management; Environmental Science and Engineering,
Lin, Hsiao-Hsien ; Lo, Chih-Cheng ; Perng, Yuan-Shing... - p. 229-243 , 2024
Link: https://doi.org/10.1007/..
 
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10

FOODwell:

, In: Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems,
Hsieh, An-Ting ; Hsiao, Chih-Ching ; Tsai, Hsin-Hua.. - p. 1-6 , 2023
Link: https://dl.acm.org/doi/1..
 
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11

Air-Coupled Piezoelectric Micromachining Ultrasonic Transdu..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Kao, Chien-Lun ; Hsu, Han-Jen ; Lin, Hsiao-Chi... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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12

Real-time LiDAR module with 64x128-pixel CMOS SPAD array an..:

, In: 2022 IEEE Sensors Applications Symposium (SAS),
Hsiao, An-Tai ; Liu, Chun-Hsien ; Chen, Po-Hsuan... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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13

Investigation of Factorized Optical Flows as Mid-Level Repr..:

, In: 2022 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS),
Yang, Hsuan-Kung ; Hsiao, Tsu-Ching ; Liao, Ting-Hsuan... - p. 746-753 , 2022
Link: https://doi.org/10.1109/..
 
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14

Seethevoice: Learning from Music to Visual Storytelling of ..:

, In: 2018 IEEE International Conference on Multimedia and Expo (ICME),
Wei, Wen-Li ; Lin, Jen-Chun ; Liu, Tyng-Luh... - p. 1-6 , 2018
Link: https://doi.org/10.1109/..
 
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15

Demonstration of Record Breakdown up to 13.5 kV in NiO/β-Ga..:

, In: 2024 Device Research Conference (DRC),
Li, Jian-Sian ; Wan, Hsiao-Hsuan ; Chiang, Chao-Ching... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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