Liu, Hua-Hsing
75  results:
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1

Hardware Engine of Limbus Circle Matching for Visible-Spect..:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),
 
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2

CMOS-compatible GaN HEMT on 200mm Si-substrate for RF appli..:

, In: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Yeh, Po-Chun ; Tu, Po-Tsung ; Liu, Hsueh-Hsing... - p. 1-2 , 2021
 
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3

An Intelligent Robotic System for Handling and Laser Markin..:

, In: Technologies and Eco-innovation towards Sustainability I,
Liu, Chih-Hsing ; Chen, Ta-Lun ; Pai, Tzu-Yang... - p. 75-88 , 2019
 
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4

34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Tai-Hao ; Hsu, Hung-Hsi ; Khwa, Win-San... - p. 580-582 , 2024
 
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5

Energy efficiency measurement for multimedia audio decoding..:

, In: Proceedings of the 2nd international conference on Ubiquitous information management and communication,
Lin, Chu-Hsing ; Shih, Chih-Hsiong ; Liu, Jung-Chun.. - p. 404-408 , 2008
 
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6

A Topology Optimization Method to Synthesize Geometrically ..:

, In: Advances in Mechanism and Machine Science; Mechanisms and Machine Science,
Liu, Chih-Hsing ; Chen, Ta-Lun ; Chung, Fu-Ming. - p. 259-268 , 2023
 
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7

Highly stable BiFeO3 RRAM with multilevel storage applicati..:

, In: International Conference on Innovation, Communication and Engineering (ICICE 2023),
 
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8

A Study on the Application of Geospatial Analysis to the As..:

, In: Lecture Notes in Electrical Engineering; Frontier Computing,
 
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9

GaN on Si RF performance with different AlGaN back barrier:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Hsieh, Chang-Yan ; Chen, Hui-Yu ; Tu, Po-Tsung... - p. 1-2 , 2023
 
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10

Design of a Magnetic Probe for Land Subsidence Monitoring:

, In: 2022 IEEE International Conference on Consumer Electronics - Taiwan,
Pai, Tzu-Yang ; Wu, Tsung-Hsun ; Liu, Chih-Hsing. - p. 477-478 , 2022
 
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11

Topology and Geometry optimization for Design of a 3D Print..:

, In: 2020 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM),
Liu, Chih-Hsing ; Hsu, Mao-Cheng ; Chen, Ta-Lun - p. 553-558 , 2020
 
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12

A Topology-Optimized 3D Printed Compliant Finger with Flex ..:

, In: 2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM),
Liu, Chih-Hsing ; Hsu, Mao-Cheng ; Chen, Yang.. - p. 92-97 , 2019
 
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13

The Framework of the Integration of Carbon Footprint and Bl..:

, In: Technologies and Eco-innovation towards Sustainability I,
 
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14

Information visualization- in regarding to customer journey..:

, In: 2018 1st IEEE International Conference on Knowledge Innovation and Invention (ICKII),
Liu, Wen-Hsing ; Chiang, Zun-Hwa - p. 142-145 , 2018
 
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15

The Development of Sustainable Materials Management (SMM) a..:

, In: Waste Management and Resource Efficiency,
Tzou, Leon ; Liu, Kun-Hsing ; Hu, Allen H. - p. 209-217 , 2018
 
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