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2024 International Conference on Electronics Packaging (ICEP) ,
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High Temperature Hygroscopic Swelling of Polymers in Electr..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Low temperature interconnects in 1st level packaging and it..:
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2022 International Conference on Electronics Packaging (ICEP) ,
3
Novel Method for Measuring High Temperature Hygroscopic Swe..:
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2021 International Conference on Electronics Packaging (ICEP) ,
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Low temperature 1st level interconnect in Packaging and its..:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Predictive Modelling Methodologies for Bi-material Strip Wa..:
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2006 International Conference on Electronic Materials and Packaging ,
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Industry Drop Tests in Solder Joint Reliability Study of Mo..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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High Density Interconnect (HDI) Socket Flow & Waprage Predi..:
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Lecture Notes in Mechanical Engineering; RiTA 2020 ,
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Waypoint Planning for Mono Visual Drone Using the Minimal B..:
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Healthy Ageing and Longevity; Gut Microbiota in Aging and Chronic Diseases ,
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