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2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
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200mm GaN-on-Si E-Mode Power HEMTs with Epitaxially Grown p..:
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2024 IEEE Wireless Communications and Networking Conference (WCNC) ,
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An Energy Optimization Algorithm for UAV-Assisted Satellite..:
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2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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The Constraint Artificial-Intelligence Assisted Method for ..:
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2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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A Case of Plasma-Induced Film Breakdown in 3D NAND BEOL Die..:
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2024 IEEE International Memory Workshop (IMW) ,
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Improved 3D DRAM Design Based on Gate-Controlled Thyristor ..:
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Proceedings of the 2023 7th International Conference on Medical and Health Informatics ,
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Using the Concept of Generative Adversarial Network (GAN) t..:
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2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio..:
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2023 International Electron Devices Meeting (IEDM) ,
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A Highly Pitch-Scalable Capacitor-less 3D DRAM Using Cross-..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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Chip Demonstration of a High-Density (43Gb) and High-Search..:
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2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO) ,
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ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:
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2022 International Electron Devices Meeting (IEDM) ,
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Analog Computing in Memory (CIM) Technique for General Matr..:
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2020 IEEE Custom Integrated Circuits Conference (CICC) ,
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A 368 × 184 Optical Under-Display Fingerprint Sensor With G..:
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2020 IEEE Symposium on VLSI Technology ,
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An Extremely Scaled Hemi-Cylindrical (HC) 3D NAND Device wi..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
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A Novel Double-Density Hemi-Cylindrical (HC) Structure to P..:
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2019 8th International Conference on Innovation, Communication and Engineering (ICICE) ,
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