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Lu, Chih-Hung
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1

200mm GaN-on-Si E-Mode Power HEMTs with Epitaxially Grown p..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Huang, Zhen-Hong ; Chang, Chia-Hao ; Lo, Ting-Chun... - p. 319-322 , 2024
Link: https://doi.org/10.1109/..
 
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2

An Energy Optimization Algorithm for UAV-Assisted Satellite..:

, In: 2024 IEEE Wireless Communications and Networking Conference (WCNC),
Lu, Chih-Hung ; Sheu, Jang-Ping ; Hsieh, Chi-Yu - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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3

The Constraint Artificial-Intelligence Assisted Method for ..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Liang, Ying-Hung ; Tsai, Cheng-En... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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4

A Case of Plasma-Induced Film Breakdown in 3D NAND BEOL Die..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Liang, Ying-Hung ; Chiu, Yuan-Chieh ; Yang, Zusing... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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5

Improved 3D DRAM Design Based on Gate-Controlled Thyristor ..:

, In: 2024 IEEE International Memory Workshop (IMW),
Chen, Wei-Chen ; Lue, Hang-Ting ; Wu, Ming-Hung... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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6

Using the Concept of Generative Adversarial Network (GAN) t..:

, In: Proceedings of the 2023 7th International Conference on Medical and Health Informatics,
Jen, Chih-Hung ; Fan, Shu-Kai S. ; Lu, Kun-Mu... - p. 297-302 , 2023
Link: https://dl.acm.org/doi/1..
 
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7

Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Chih-Chin ; Hsiao, Ching-Hung ; Chen, Yi-Che... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

A Highly Pitch-Scalable Capacitor-less 3D DRAM Using Cross-..:

, In: 2023 International Electron Devices Meeting (IEDM),
Chen, Wei-Chen ; Lue, Hang-Ting ; Wu, Ming-Hung... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

Chip Demonstration of a High-Density (43Gb) and High-Search..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hsieh, Chih-Chang ; Lue, Hang-Ting ; Li, Yung-Chun... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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10

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
Link: https://doi.org/10.1109/..
 
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11

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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12

A 368 × 184 Optical Under-Display Fingerprint Sensor With G..:

, In: 2020 IEEE Custom Integrated Circuits Conference (CICC),
Yin, Ping-Hung ; Lu, Chih-Wen ; Wang, Jia-Shyang... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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13

An Extremely Scaled Hemi-Cylindrical (HC) 3D NAND Device wi..:

, In: 2020 IEEE Symposium on VLSI Technology,
Du, Pei-Ying ; Lue, Hang-Ting ; Yeh, Teng-Hao... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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14

A Novel Double-Density Hemi-Cylindrical (HC) Structure to P..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Jiang, Yu-Wei ; Hung, Min-Feng... - p. 28.2.1-28.2.4 , 2019
Link: https://doi.org/10.1109/..
 
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15

Hiding Secret Image in Absolute Moment Block Truncation Cod..:

, In: 2019 8th International Conference on Innovation, Communication and Engineering (ICICE),
Liao, Jhe-Huei ; Horng, Ji-Hwei ; Lee, Chih-Hung. - p. 39-42 , 2019
Link: https://doi.org/10.1109/..
 
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