Lu, Hsiang-Chih
291  results:
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1

Shadow Removal Through Learning-Based Region Matching and M..:

, In: 2022 IEEE International Conference on Multimedia and Expo (ICME),
 
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2

Variation-tolerant and self-repair design methodology for l..:

, In: Proceedings of the 16th Asia and South Pacific Design Automation Conference,
Ho, Chih-Hsiang ; Lu, Chao ; Mohapatra, Debabrata. - p. 695-700 , 2011
 
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3

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
 
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4

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
 
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5

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
 
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6

Fabrication of arrays of (100) Cu under-bump-metallization ..:

, In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC),
Chiu, Wei-Lan ; Lu, Chia-Ling ; Lin, Han-Wen... - p. 518-522 , 2015
 
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7

Nano-porous membranes mediate podocyte proliferation and mo..:

, In: The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),
 
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8

Detecting buried voids in copper interconnect:

, In: 2013 e-Manufacturing & Design Collaboration Symposium (eMDC),
 
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9

Efficient Semantic Segmentation of Optical Coherence Tomogr..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
 
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10

LG-LSQ: Learned Gradient Linear Symmetric Quantization for ..:

, In: 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS),
 
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11

Design and Implementation of Air Conditioning Monitoring Sy..:

, In: 2023 IEEE 12th Global Conference on Consumer Electronics (GCCE),
Liao, Teh-Lu ; Yang, Ming-Hsiang ; Lai, Ying-Chih.. - p. 260-261 , 2023
 
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12

Advanced Fanout Packaging Technology for Hybrid Substrate I..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Lee, Teck Chong ; Chen, Rick... - p. 1362-1370 , 2022
 
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13

15.5 A 28nm 64Kb 6T SRAM Computing-in-Memory Macro with 8b ..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Si, Xin ; Tu, Yung-Ning ; Huang, Wei-Hsing... - p. 246-248 , 2020
 
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14

Study of the Walk-Out Effect of Junction Breakdown Instabil..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
 
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15

AIM 2019 Challenge on Real-World Image Super-Resolution: Me..:

, In: 2019 IEEE/CVF International Conference on Computer Vision Workshop (ICCVW),
Lugmayr, Andreas ; Danelljan, Martin ; Timofte, Radu... - p. 3575-3583 , 2019
 
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