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Lu, Ju-Ming
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1

Butt-Coupling Optical Probe Card for Wafer-Scale Photonic-I..:

, In: 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC),
Wu, Cheng-Yu ; Lee, Ming-Chang M. ; Lu, Mei-Ju... - p. 1-1 , 2023
Link: https://doi.org/10.1109/..
 
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2

Serious Leisure and Flow Experience of Teenagers - A Case S..:

, In: Innovative Mobile and Internet Services in Ubiquitous Computing; Advances in Intelligent Systems and Computing,
Torng, Chiou-Shya ; Weng, Ming-Sui ; Lu, Chai-Ju - p. 735-740 , 2017
Link: https://doi.org/10.1007/..
 
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3

Robust Coreset Construction for Distributed Machine Learnin:

, In: 2019 IEEE Global Communications Conference (GLOBECOM),
Lu, Hanlin ; Li, Ming-Ju ; He, Ting... - p. 1-6 , 2019
Link: https://doi.org/10.1109/..
 
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4

Machine Learning Accelerated Insights of Perovskite Materia..:

, In: Artificial Intelligence for Materials Science; Springer Series in Materials Science,
Lu, Shuaihua ; Wu, Yilei ; Ju, Ming-Gang. - p. 197-223 , 2021
Link: https://doi.org/10.1007/..
 
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5

Affinity Foam Fractionation of Trichoderma Cellulase:

, In: Twenty-Seventh Symposium on Biotechnology for Fuels and Chemicals; ABAB Symposium,
Zhang, Qin ; Lo, Chi-Ming ; Ju, Lu-Kwang - p. 1051-1065 ,
Link: https://doi.org/10.1007/..
 
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6

Reshaping System Design in 3D Integration : Perspectives..:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Chen, Hung-Ming ; Ho, Chu-Wen ; Wu, Shih-Hsien... - p. 71-77 , 2023
Link: https://dl.acm.org/doi/1..
 
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7

Design of a Soft Isolation Mechanism for Kubernetes-Based M..:

, In: 2022 8th International Conference on Applied System Innovation (ICASI),
Lu, Yung-Feng ; Chen, Hung-Ming ; Zhong, Meng-Ju. - p. 183-186 , 2022
Link: https://doi.org/10.1109/..
 
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8

Using Mobile Phones to Facilitate Alcohol Dependent Patient..:

, In: Proceedings of the 2018 ACM International Joint Conference and 2018 International Symposium on Pervasive and Ubiquitous Computing and Wearable Computers,
You, Chuang-Wen ; Tsai, Jui-Ting ; Lin, Hung-Yeh... - p. 311-314 , 2018
Link: https://dl.acm.org/doi/1..
 
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9

List of Contributors:

, In: Epigenetics and Dermatology,
Altorok, Nezam ; Arbiser, Jack L. ; Bonner, Michael Y.... - p. xiii-xvi , 2015
Link: https://doi.org/10.1016/..
 
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10

Contributors:

, In: Biomaterials Science,
Abramson, Sascha ; Ackermann Jr., D. Michael ; Akins, Robert... - p. xiii-xix , 2013
Link: https://doi.org/10.1016/..
 
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11

Demonstration of A 3D Chip by Logic-DRAM Stacked Using Pair..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Lu, Chun-Lin ; Chen, Chun Cheng ; Lin, Sheng-Chieh... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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12

List of contributors:

, In: Privileged Scaffolds in Drug Discovery,
Alam, Mohammad Abrar ; Cao, Jin-Xu ; Cao, Peng... - p. xvii-xxii , 2023
Link: https://doi.org/10.1016/..
 
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13

LIST OF CONTRIBUTORS:

, In: Electrochemical Sensors, Biosensors and their Biomedical Applications,
Bakker, Eric ; Doeller, Jeannette E. ; Dong, Hua... - p. xvii-xix , 2008
Link: https://doi.org/10.1016/..
 
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14

Temperature coefficient of resistance related to amorphous ..:

, In: 2016 3rd International Conference on Devices, Circuits and Systems (ICDCS),
Su, Jyun-Hao ; Yeh, Wen-Kuan ; Chang, Wen-Teng... - p. 63-67 , 2016
Link: https://doi.org/10.1109/..
 
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15

A Resistor-Based High-Resolution Temperature-to-Digital Con..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lee, Rui-Song ; Lam, Chak-Hong ; Chen, Wei-Hao... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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