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Lu, Yao-Chih
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1

Common Source Line-to-Word Line Short Improvement by Elimin..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chung, Yao-An ; Chu, Yuan-Chieh ; Chang, Chih-Chin... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Chih-Chin ; Hsiao, Ching-Hung ; Chen, Yi-Che... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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3

Improvement of Twisting and Line-Edge Roughness of 3D NAND ..:

, In: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chung, Yao-An ; Chiu, Yuan-Chieh ; Chang, Yu-Fan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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4

Machine learning Assists on High Aspect Ratio Slit Trench E..:

, In: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Yu-Fan ; Lee, Hong-Ji ; Chou, Fu-Hsing... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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5

Study of the Walk-Out Effect of Junction Breakdown Instabil..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Lo, Chieh Roger ; Yeh, Teng-Hao ; Chen, Wei-Chen... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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6

Oval-Shaped OP-Layer Hole Etching: Shape Deformation, Local..:

, In: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Chang, Yao-Yuan ; Wu, Ming-Tsung... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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7

Impact of Asymmetric Memory Hole Profile on Silicon Selecti..:

, In: 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Yao-Yuan ; Yang, Zusing ; Wu, Ming-Tsung... - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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8

Reduction of wafer arcing during high aspect ratio etching:

, In: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Hung, Min-Feng ; Chang, Kuo-Pin... - p. 421-425 , 2017
Link: https://doi.org/10.1109/..
 
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9

Investigations on elimination of plasma-induced Si substrat..:

, In: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Lin, Chih-Yao ; Lo, Chieh ; Chen, Wei-Chen... - p. 431-434 , 2017
Link: https://doi.org/10.1109/..
 
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10

Multi-Level Operation of Fully CMOS Compatible WOX Resistiv..:

, In: 2009 IEEE International Memory Workshop,
Chien, W. C. ; Chen, Y. C. ; Chang, K. P.... - p. None , 2009
Link: https://doi.org/10.1109/..
 
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11

Dual Graph Networks with Synthetic Oversampling for Imbalan..:

, In: Companion Proceedings of the ACM on Web Conference 2024,
Lu, Yen-Wen ; Chen, Chih-Yao ; Li, Cheng-Te - p. 750-753 , 2024
Link: https://dl.acm.org/doi/1..
 
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12

A 14-nm Low-Cost IF Transceiver IC with Low-Jitter LO and F..:

, In: 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Wu, Wanghua ; Lee, Jeiyoung ; Lau, Pak-Kim... - p. 277-280 , 2023
Link: https://doi.org/10.1109/..
 
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13

A 16-Channel, 28/39GHz Dual-Polarized 5G FR2 Phased-Array T..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Verma, Ashutosh ; Bhagavatula, Venu ; Singh, Amitoj... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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14

OSC Based Gas Sensor for Detecting Agriculture Ammonia Wate..:

, In: 2023 IEEE SENSORS,
Chiang, Chih-Lu ; Huang, Yu-Yu ; Liu, Te-Yao... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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15

Detecting buried voids in copper interconnect:

, In: 2013 e-Manufacturing & Design Collaboration Symposium (eMDC),
Liao, Hsiang-Chou ; SiYeul Yoon ; Moreau, Olivier... - p. 1-4 , 2013
Link: https://doi.org/10.1109/..
 
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