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Luo, Xiaobing
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1

The Path Traversal Method for the Orientation Information o..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Zhang, Xinfeng ; Fan, Yiwen ; Yang, Xuan... - p. 620-624 , 2023
Link: https://doi.org/10.1109/..
 
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2

A High Flow Rate Piezoelectric Micropump for Miniature Liqu..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Fan, Yiwen ; Zhang, Xinfeng ; Xing, Guanying... - p. 999-1004 , 2023
Link: https://doi.org/10.1109/..
 
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3

In-plane Heat Transfer Enhancement of Phosphor Layer in Tra..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhao, Weixian ; Xie, Bin ; Hu, Run. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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4

Thermal management for high-power downhole electronics usin..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Peng, Jiale ; Lan, Wei ; Wei, Fulong.. - p. 935-940 , 2022
Link: https://doi.org/10.1109/..
 
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5

Experimental and Numerical Investigation of Low Melting Poi..:

, In: 2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC),
Deng, Chao ; Wei, Fulong ; Lan, Wei.. - p. 49-54 , 2022
Link: https://doi.org/10.1109/..
 
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6

Thermal Optimization of a Logging Tool Used in High Tempera..:

, In: 2022 IEEE International Power Electronics and Application Conference and Exposition (PEAC),
Wei, Fulong ; Deng, Chao ; Peng, Jiale. - p. 72-77 , 2022
Link: https://doi.org/10.1109/..
 
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7

Thermal Management of the High-power Electronics in High Te..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Peng, Jiale ; Lan, Wei ; Wang, Yujun.. - p. 369-375 , 2020
Link: https://doi.org/10.1109/..
 
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8

A new substrate for realizing hemispherical encapsulant lay..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Xia, Puzhen ; Yu, Xingjian ; Luo, Xiaobing - p. 40-43 , 2019
Link: https://doi.org/10.1109/..
 
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9

List of contributors:

, In: Nitride Semiconductor Light-Emitting Diodes (LEDs),
Ajay, Akhil ; Arefin, Nazmul ; Bertazzi, Francesco... - p. xi-xiii , 2018
Link: https://doi.org/10.1016/..
 
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10

Chip packaging:

, In: Nitride Semiconductor Light-Emitting Diodes (LEDs),
Luo, Xiaobing ; Hu, Run - p. 491-528 , 2018
Link: https://doi.org/10.1016/..
 
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11

Investigation on dip-transfer phosphor coating for light-em..:

, In: 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Yu, Xingjian ; Ma, Yupu ; Shang, Bofeng... - p. 987-991 , 2017
Link: https://doi.org/10.1109/..
 
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12

Velocity and Temperature Simulation of a New Air Flow Senso:

, In: 2006 7th International Conference on Electronic Packaging Technology,
Yu, Bolin ; Gan, Zhiyin ; Liu, Sheng... - p. None , 2006
Link: https://doi.org/10.1109/..
 
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13

Correlation Comparison Testing between Traffic Speed Deflec..:

, In: 2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI),
Luo, Yingchao ; An, Huazhen ; Li, Xiaobing. - p. 62-67 , 2023
Link: https://doi.org/10.1109/..
 
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14

AIM 2022 Challenge on Super-Resolution of Compressed Image ..:

, In: Lecture Notes in Computer Science; Computer Vision – ECCV 2022 Workshops,
Yang, Ren ; Timofte, Radu ; Li, Xin... - p. 174-202 , 2023
Link: https://doi.org/10.1007/..
 
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15

Harnessing Edge Computing Resources for Accelerating Indust..:

, In: 2023 19th International Conference on Mobility, Sensing and Networking (MSN),
Xing, Tao ; Cui, Helei ; Chen, Yaxing... - p. 652-659 , 2023
Link: https://doi.org/10.1109/..
 
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