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Lyu, Ping-ping
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1

Exploration on the Path of Integrating State-Owned Public H..:

, In: Proceedings of the 23rd International Symposium on Advancement of Construction Management and Real Estate,
Ma, Wenyue ; Lyu, Ping ; Yu, Miao. - p. 503-515 , 2021
Link: https://doi.org/10.1007/..
 
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2

A combined simulation and experimental study on cracking an..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Bin ; Lyu, Guang-Chao ; Wang, Hong-Guang... - p. 2046-2053 , 2023
Link: https://doi.org/10.1109/..
 
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3

H-MIS: A Hierarchical Multi-Identifier System Based on Bloc..:

, In: 2023 IEEE International Conference on Big Data (BigData),
Lyu, Qi ; Li, Hui ; Lin, Xinnan... - p. 2326-2333 , 2023
Link: https://doi.org/10.1109/..
 
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4

Dense Distinct Query for End-to-End Object Detection:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),
Zhang, Shilong ; Wang, Xinjiang ; Wang, Jiaqi... - p. 7329-7338 , 2023
Link: https://doi.org/10.1109/..
 
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5

An Extensive Study of the Effects of Packaging Structure an..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Lyu, Guang-Chao ; Chen, Bin ; Zhang, Xin-Ping... - p. 647-654 , 2023
Link: https://doi.org/10.1109/..
 
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6

FePd Single Layer and Synthetic Antiferromagnet with Low Da..:

, In: 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers),
Lyu, Deyuan ; Shoup, Jenae E. ; Huang, Dingbin... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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7

Finite Element Simulation Study of the Effects of Kirkendal..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Luo, Ming-Sheng ; Wang, Hong-Guang ; Chen, Bin.. - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

Contributors:

, In: Metal Oxides for Optoelectronics and Optics-Based Medical Applications,
Ab Rahman, Marlinda ; Abdul Wahab, Yasmin Binti ; Abubakar, Shamsu... - p. xi-xiv , 2022
Link: https://doi.org/10.1016/..
 
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9

A Comprehensive Study of Crack Initiation and Delamination ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Wang, Hong-Guang ; Lyu, Guang-Chao ; Deng, Yun-Kai... - p. 1459-1464 , 2022
Link: https://doi.org/10.1109/..
 
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10

Optimizing Parallel Proof of Vote Consensus Based on Mimic ..:

, In: 2022 IEEE International Conference on Big Data (Big Data),
Xiao, Zhenwei ; Li, Hui ; Wang, Han... - p. 3215-3224 , 2022
Link: https://doi.org/10.1109/..
 
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11

Metal oxide-based photodetectors (from IR to UV):

, In: Metal Oxides for Optoelectronics and Optics-Based Medical Applications,
Ma, Zhong ; Zhang, Jing ; Lyu, Hanbai... - p. 117-150 , 2022
Link: https://doi.org/10.1016/..
 
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12

Interfacial Delamination Characterization and Thermo-mechan..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Chen, Bin ; Wang, Hong-Guang ; Lyu, Guang-Chao... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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13

Three-dimensional Finite Element Analysis of Interfacial De..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Lyu, Guang-Chao ; Zhou, Min-Bo ; Zhang, Xin-Ping - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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14

An extensive simulation study of the interfacial delaminati..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lyu, Guang-Chao ; Wang, Hong-Guang ; Zhou, Min-Bo. - p. 1614-1623 , 2022
Link: https://doi.org/10.1109/..
 
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15

Moisture Desorption and Hygro-Vapor-Thermal Induced Interfa..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zheng, Long ; Deng, Yun-Kai ; Wang, Hong-Guang... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
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