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Magbitang, Teddie
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Characterization of Non-Conductive Paste Materials (NCP) fo..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Horibe, Akihiro ; Watanabe, Takahito ; Marushima, Chinami... - p. 625-630 , 2022
Link: https://doi.org/10.1109/..
 
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Reworkable & rehealable packaging materials from the introd..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Magbitang, Teddie ; Moore, Lucas ; Yu, Roy... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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