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Martin, Steve
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1

Chemical thinning approach for high-topography glass wafers:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Bedjaoui, Messaoud ; Brun, Jean ; Martin, Steve. - p. 49-55 , 2020
Link: https://doi.org/10.1109/..
 
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2

Interactive rendering of fenestration materials for archite..:

, In: ACM SIGGRAPH 2007 posters,
Sheng, Yu ; Martin, Steve ; Cutler, Barbara - p. 173-es , 2007
Link: https://dl.acm.org/doi/1..
 
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3

Drowsy caches : simple techniques for reducing leakage p..:

, In: Proceedings of the 29th annual international symposium on Computer architecture,
Flautner, Krisztián ; Kim, Nam Sung ; Martin, Steve.. - p. 148-157 , 2002
Link: https://dl.acm.org/doi/1..
 
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4

Using a menu-based natural language interface to ask map- a..:

, In: Proceedings of the 1985 ACM annual conference on The range of computing : mid-80's perspective: mid-80's perspective,
Thompson, Craig W. ; Martin, Steve - p. 328-338 , 1985
Link: https://dl.acm.org/doi/1..
 
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5

Contributors:

, In: Rheumatology,
Abdellatif, Engy ; Abeles, Aryeh M. ; Abelson, Abby G.... - p. vii-xxii , 2015
Link: https://doi.org/10.1016/..
 
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6

List of Contributors:

, In: Interventions for Addiction,
Abraham, Amanda J. ; Ait-Daoud, Nassima ; Alessi, Sheila M.... - p. xiii-xvi , 2013
Link: https://doi.org/10.1016/..
 
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7

A Way Forward for the MDCG 2019-16 Medical Device Security ..:

, In: Proceedings of the 17th International Conference on PErvasive Technologies Related to Assistive Environments,
Taylor, Steve ; Gilje Jaatun, Martin ; Bernsmed, Karin... - p. 593-599 , 2024
Link: https://dl.acm.org/doi/1..
 
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8

COVID-19 and the Travel and Visitor Experience Economy: Cha..:

, In: Tourist Behaviour and the New Normal, Volume I,
Kimunio, Isaac ; Nandelenga, Martin W. ; Makambi, Steve - p. 109-126 , 2024
Link: https://doi.org/10.1007/..
 
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9

Tourism Degrowth in the New Normal: Exploring the Impacts o..:

, In: Tourist Behaviour and the New Normal, Volume II,
Kimunio, Isaac ; Nandelenga, Martin W. ; Makambi, Steve - p. 281-297 , 2024
Link: https://doi.org/10.1007/..
 
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10

How to Manipulate Warpage in Fan-out Wafer and Panel Level ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Braun, Tanja ; Holck, Ole ; Adler, Marius... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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11

Closed loop optimization of 5G network slices:

, In: 2023 15th International Conference on COMmunication Systems & NETworkS (COMSNETS),
Govindarajan, Kavya ; Goel, Seep ; Jayachandran, Praveen... - p. 186-188 , 2023
Link: https://doi.org/10.1109/..
 
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12

Indoor and Outdoor Evaluation of Curved Modules for VIPV:

, In: 2023 IEEE 50th Photovoltaic Specialists Conference (PVSC),
Herrero, Rebeca ; Anton, Ignacio ; Martin, Francisco... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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13

Software Bill of Materials in Critical Infrastructure:

, In: 2023 IEEE International Conference on Cloud Computing Technology and Science (CloudCom),
Jaatun, Lars Andreassen ; Marie Sorlien, Silje ; Borgaonkar, Ravishankar.. - p. 319-324 , 2023
Link: https://doi.org/10.1109/..
 
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14

Corrosion and Erosion Protection to Accelerate Deployment o..:

, In: Energy Technology 2023; The Minerals, Metals & Materials Series,
Shower, Patrick ; Weaver, Scott ; Dheeradhada, Voramon... - p. 15-25 , 2023
Link: https://doi.org/10.1007/..
 
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15

List of contributors:

, In: Transcriptome Profiling,
Almeida, Déborah Aires ; Aono, Alexandre Hild ; Assmann, Taís Silveira... - p. xi-xiv , 2023
Link: https://doi.org/10.1016/..
 
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