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McDonald, Stuart
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1

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloy:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Tan, Xin F. ; Hao, Qichao ; Zhou, Jiye... - p. 207-208 , 2024
Link: https://doi.org/10.23919..
 
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2

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Fre..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhou, Jiye ; Tan, Xin F. ; McDonald, Stuart D.... - p. 81-82 , 2024
Link: https://doi.org/10.23919..
 
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3

Community Healthcare: Safety, Privacy, and Usability of Sma..:

, In: 2024 Second International Conference on Emerging Trends in Information Technology and Engineering (ICETITE),
Cai, Tianhong ; Zhang, Xiang ; Li, Yinglun.. - p. 1-7 , 2024
Link: https://doi.org/10.1109/..
 
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4

In-situ observations of CU6Sn5 mophological changes at the ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Nogita, Kazuhiro ; Tan, Xin F. ; Somidin, Flora... - p. 215-216 , 2024
Link: https://doi.org/10.23919..
 
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5

Fluidity and Microstructural Analysis of Al–Ni Alloys with ..:

, In: The Minerals, Metals & Materials Series; Light Metals 2023,
Hari, Vigneshwar ; Xu, Dong ; McDonald, Stuart D.... - p. 457-464 , 2023
Link: https://doi.org/10.1007/..
 
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6

Evolution of the Sn-Bi Solder Microstructure vs. Temperatur..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Tan, Xin F. ; Zhou, Jiye ; McDonald, Stuart D... - p. 203-204 , 2023
Link: https://doi.org/10.23919..
 
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7

Controlling porosity during transient liquid phase bonding ..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Abdul Razak, Nurul R. ; Tan, Xin F. ; McDonald, Stuart D.... - p. 27-28 , 2023
Link: https://doi.org/10.23919..
 
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8

The Effects of Solution Treatment and Room Temperature Agei..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Ye, Xiaozhou ; Tao, Lei ; McDonald, Stuart D.... - p. 215-216 , 2023
Link: https://doi.org/10.23919..
 
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9

Social Impact of Smart Environments: Software Engineering P..:

, In: 2022 IEEE 46th Annual Computers, Software, and Applications Conference (COMPSAC),
McDonald, Stuart ; Towey, Dave ; Brusic, Vladimir - p. 1592-1597 , 2022
Link: https://doi.org/10.1109/..
 
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10

The development of ethically informed standards for intelli..:

, In: 2022 IEEE 46th Annual Computers, Software, and Applications Conference (COMPSAC),
Shang, Kun ; McDonald, Stuart ; Buticchi, Giampaolo. - p. 1598-1605 , 2022
Link: https://doi.org/10.1109/..
 
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11

Investigation of the Effects of Surface Finish and Reflow C..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Somidin, Flora ; Akaiwa, Tetsuya ; McDonald, Stuart D.... - p. 177-178 , 2022
Link: https://doi.org/10.23919..
 
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12

Comparison of the Mechanical Properties of Conventional Pb-..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Hao, Qichao ; Tan, Xin Fu ; McDonald, Stuart D.... - p. 173-174 , 2022
Link: https://doi.org/10.23919..
 
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13

Effect of Microstructural Refinement and Na Addition on Hyd..:

, In: The Minerals, Metals & Materials Series; Magnesium Technology 2022,
Kim, Manjin ; McDonald, Stuart D. ; Ali, Yahia.. - p. 69-76 , 2022
Link: https://doi.org/10.1007/..
 
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14

Maximum Fluidity Length of Commercial Solder Alloys and the..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Nogita, Kazuhiro ; Read, Jonathan ; McDonald, Stuart D... - p. 175-176 , 2022
Link: https://doi.org/10.23919..
 
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15

The Independent Effects of Cooling Rate and Na Addition on ..:

, In: The Minerals, Metals & Materials Series; Magnesium Technology 2020,
Kim, Manjin ; Ali, Yahia ; McDonald, Stuart D... - p. 289-297 , 2020
Link: https://doi.org/10.1007/..
 
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