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McMillan, Jourdan K
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1

Quantitative Measurement of Resistance to Passive Joint Mot..:

, In: Spasticity and Muscle Stiffness,
Ewoldt, Jourdan K. ; Raghavan, Preeti ; Suresh, Nina L. - p. 47-62 , 2022
Link: https://doi.org/10.1007/..
 
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2

Contributors:

, In: Surgical Techniques of the Shoulder, Elbow, and Knee in Sports Medicine,
Abdelaziz, Abed ; Abrams, Geoffrey D. ; Adams, Christopher R.... - p. x-xx , 2022
Link: https://doi.org/10.1016/..
 
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3

Contributors:

, In: Methods and Applications of Geochronology,
Assis Fernandes, Vera ; Burgess, Ray ; Camacho, Alfredo... - p. xiii-xv , 2024
Link: https://doi.org/10.1016/..
 
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4

Measuring Improvement of F1-Scores in Detection of Self-Adm..:

, In: 2023 ACM/IEEE International Conference on Technical Debt (TechDebt),
Aiken, William ; Mvula, Paul K. ; Branco, Paula... - p. 37-41 , 2023
Link: https://doi.org/10.1109/..
 
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5

HEART: Heterogeneous Log Anomaly Detection Using Robust Tra..:

, In: Discovery Science; Lecture Notes in Computer Science,
Mvula, Paul K. ; Branco, Paula ; Jourdan, Guy-Vincent. - p. 673-687 , 2023
Link: https://doi.org/10.1007/..
 
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6

Enabling 3-level High Aspect Ratio Supervias for 3nm nodes ..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Montero, D. ; Vega-Gonzalez, V. ; Feurprier, Y.... - p. 48-50 , 2022
Link: https://doi.org/10.1109/..
 
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7

Buried Power Rail Metal exploration towards the 1 nm Node:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Gupta, A. ; Radisic, D. ; Maes, J. W.... - p. 22.5.1-22.5.4 , 2021
Link: https://doi.org/10.1109/..
 
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8

Hybrid Metallization with Cu in sub 30nm Interconnects:

, In: 2020 IEEE International Interconnect Technology Conference (IITC),
van der Veen, Marleen H. ; Soethoudt, J. ; Delabie, A.... - p. 16-18 , 2020
Link: https://doi.org/10.1109/..
 
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9

Buried Power Rail Scaling and Metal Assessment for the 3 nm..:

, In: 2020 IEEE International Electron Devices Meeting (IEDM),
Gupta, A. ; Pedreira, O. Varela ; Tao, Z.... - p. 20.3.1-20.3.4 , 2020
Link: https://doi.org/10.1109/..
 
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10

Buried Power Rail Integration with Si FinFETs for CMOS Scal..:

, In: 2020 IEEE Symposium on VLSI Technology,
Gupta, A. ; Mertens, H. ; Tao, Z.... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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11

Contributors:

, In: Lipid Signaling and Metabolism,
Abokor, Ahmed A. ; Albanesi, Daniela ; Arabolaza, Ana... - p. xiii-xvii , 2020
Link: https://doi.org/10.1016/..
 
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12

Dielectric Reliability Study of 21 nm Pitch Interconnects w..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Lesniewska, A. ; Roussel, P.J. ; Tierno, D.... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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13

Three-Layer BEOL Process Integration with Supervia and Self..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Vega-Gonzalez, V. ; Bekaert, J. ; Kesters, E.... - p. 19.3.1-19.3.4 , 2019
Link: https://doi.org/10.1109/..
 
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14

Contributors:

, In: Soil Management and Climate Change,
Adeolu, Adesiji R. ; Agelaki, Katerina ; Alabi, Taofic... - p. ix-xii , 2018
Link: https://doi.org/10.1016/..
 
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15

Assessing Effects Through Semi-Field and Field Toxicity Tes..:

, In: Pesticide Risk Assessment for Pollinators,
Pettis, J. ; Tornier, I. ; Clook, M.... - p. 95-119 , 2014
Link: https://doi.org/10.1002/..
 
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