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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
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A Gate Driver Circuit for Crosstalk Suppression of SiC MOSF..:
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2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS) ,
2
Design of a Novel Double Sided Cooling SiC Power Module Bas..:
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2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS) ,
3
Gate Driver Optimization to Suppress Bridge-Leg Crosstalk a..:
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2023 IEEE 14th International Symposium on Power Electronics for Distributed Generation Systems (PEDG) ,
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A Double-Sided 650 V GaN Power Device Using Flexible Buffer..:
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2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS) ,
5
Simulation of Thermal Distribution in SiC Power Modules wit..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
6
How to pressureless sinter-bond power chips with bare coppe..:
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2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
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Die-attach on Copper by Pressureless Silver Sintering in Fo..:
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Computer Vision – ECCV 2020; Lecture Notes in Computer Science ,
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Measuring Generalisation to Unseen Viewpoints, Articulation..:
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