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Moon, Kyoung-Jun
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1

A 12-bit 10GS/s 16-Channel Time-Interleaved ADC with a Digi..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Moon, Kyoung-Jun ; Oh, Dong-Ryeol ; Park, Young-Hyo... - p. 172-173 , 2022
Link: https://doi.org/10.1109/..
 
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2

An 8b 1GS/s 2.55mW SAR-Flash ADC with Complementary Dynamic..:

, In: 2020 IEEE Symposium on VLSI Circuits,
Oh, Dong-Ryeol ; Moon, Kyoung-Jun ; Lim, Won-Mook... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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3

Gigahertz Harmonic Mode-Locking of Fiber Laser Stabilized b..:

, In: 2020 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Han, Dae Seok ; Ha, Chang Kyun ; Moon, Kyoung Jun.. - p. 1-2 , 2020
Link: https://doi.org/10.1364/..
 
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4

Brillouin-Assisted Supramolecular Soliton Array Generation ..:

, In: 2020 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Moon, Kyoung Jun ; Han, Dae Seok ; Kang, Myeong Soo - p. 1-2 , 2020
Link: https://doi.org/10.1364/..
 
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5

Optoacoustic Manipulation of Quasi-Continuous-Wave Backgrou..:

, In: 2020 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Lee, Ki Sang ; Ha, Chang Kyun ; Moon, Kyoung Jun.. - p. 1-2 , 2020
Link: https://doi.org/10.1364/..
 
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6

List of contributors:

, In: Biomaterials for Cancer Therapeutics,
Alhallak, Kinan ; Allen, Sean David ; Amiji, Mansoor... - p. xix-xxiii , 2020
Link: https://doi.org/10.1016/..
 
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7

A Low Loss Die-Embedded Glass Substrate for 140 GHz InP Pow..:

, In: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024,
Jia, Xiaofan ; Li, Xingchen ; Kim, Joon Woo... - p. 402-405 , 2024
Link: https://doi.org/10.1109/..
 
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8

One-step Surface Modification for Boron Nitride and its Pol..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Zihao ; Li, Jiaxiong ; Sun, Zhijian... - p. 2003-2007 , 2024
Link: https://doi.org/10.1109/..
 
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9

Bottom Side Cooling for Glass Interposer with Chip Embeddin..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Joon Woo ; Li, Xingchen ; Jia, Xiaofan.. - p. 1609-1613 , 2023
Link: https://doi.org/10.1109/..
 
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10

Chip-embedded Glass Interposer for 5G Applications:

, In: 2023 IEEE Radio and Wireless Symposium (RWS),
Li, Xingchen ; Jia, Xiaofan ; Moon, Kyoung-sik... - p. 129-131 , 2023
Link: https://doi.org/10.1109/..
 
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11

Die-Embedded Glass Interposer with Minimum Warpage for 5G/6..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Li, Xingchen ; Jia, Xiaofan ; Kim, Joon Woo... - p. 2247-2254 , 2023
Link: https://doi.org/10.1109/..
 
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12

A 4ns Settling Time FVF-Based Fast LDO Using Bandwidth Exte..:

, In: 2023 IEEE Asian Solid-State Circuits Conference (A-SSCC),
Jung, Jinook ; Choi, Jun-Han ; Roh, Kyoung-Jun... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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13

A Digital Temperature Sensor Based on 10b SAR ADC for Non-l..:

, In: 2022 IEEE Asian Solid-State Circuits Conference (A-SSCC),
Roh, Kyoung-Jun ; Jeon, Min-Ki ; Park, Jaewoo... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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14

Epoxy Resin with Metal Complex Additives for Improved Relia..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Li, Jiaxiong ; Wilson, John ; Cheung, Dylan... - p. 2018-2023 , 2022
Link: https://doi.org/10.1109/..
 
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15

Antenna-Integrated, Die-Embedded Glass Package for 6G Wirel..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jia, Xiaofan ; Li, Xingchen ; Moon, Kyoung-sik... - p. 377-383 , 2022
Link: https://doi.org/10.1109/..
 
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