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Moon, Seung Jae
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1

Comparison of Electrical Characteristics Between SiC and Si..:

, In: 2024 International Conference on Electronics, Information, and Communication (ICEIC),
Oh, Si Eun ; Kim, Seo Yoon ; Choi, Se Yong... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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2

Micro LED Pixel Circuit with Threshold Voltage Compensation:

, In: 2024 International Conference on Electronics, Information, and Communication (ICEIC),
Kim, Youngjin ; Lee, Janghoo ; Choi, Seyong... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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3

Optimizing Gate Insulator Conditions via Interfacial Oxidat..:

, In: 2024 International Conference on Electronics, Information, and Communication (ICEIC),
Hwang, Sang Hun ; Hwang, Byung Seol ; Hwang, Sang Ho... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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4

Highly Scalable Saddle-Fin (S-Fin) Transistor for Sub-50nm ..:

, In: 2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers.,
Park, Sung-Wook ; Hong, Sung-Joo ; Kim, Jin-Woong... - p. 32-33 , 2006
Link: https://doi.org/10.1109/..
 
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5

New Production system For Vessels of Composite Materials Us..:

, In: Practical Design of Ships and Other Floating Structures,
Kwon, Jong Oh ; Kim, Jaesung ; Suh, Jung Chun... - p. 367-372 , 2001
Link: https://doi.org/10.1016/..
 
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6

The Second Generation of Integrated Stack Capacitor (ISC) f..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Park, Won Ji ; Oh, Jae Hee ; Ding, Shaofeng... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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7

Fabrication and Characterization of ISC embedded Interposer..:

, In: 2021 IEEE International Interconnect Technology Conference (IITC),
Park, Won Ji ; Kang, Min Guk ; Oh, Jae Hee... - p. 1-3 , 2021
Link: https://doi.org/10.1109/..
 
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8

OFDM-based 25Gbps Wireless Backhaul System for 5G Convergen..:

, In: 2020 International Conference on Information Networking (ICOIN),
Moon, Young Jin ; Woo Kim, Jun ; Moon, Jang Won... - p. 814-817 , 2020
Link: https://doi.org/10.1109/..
 
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9

22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarte..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lee, Dong Uk ; Cho, Ho Sung ; Kim, Jihwan... - p. 334-336 , 2020
Link: https://doi.org/10.1109/..
 
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10

List of Contributors:

, In: Bladder Cancer,
Burton, Jeremy P. ; Chanyi, Ryan M. ; Cho, Jeong Y.... - p. xxi-xxiii , 2018
Link: https://doi.org/10.1016/..
 
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11

13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jinhyung ; Cho, Kyungjun ; Lee, Chang Kwon... - p. 238-240 , 2024
Link: https://doi.org/10.1109/..
 
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12

A Decentralized Control Method of Battery Energy Storage Un..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Choi, Seung-Hyun ; Kim, Jae-Sang ; Kim, Joonsu.. - p. 1736-1739 , 2024
Link: https://doi.org/10.1109/..
 
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13

A New Voltage Distribution Strategy in Input-Series Connect..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Choi, Dongmin ; Kim, Jae-Sang ; Choi, Seung-Hyun.. - p. 1336-1339 , 2024
Link: https://doi.org/10.1109/..
 
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14

High Efficiency of Asymmetric Half-Bridge Converter with Si..:

, In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia),
Park, Jeongchan ; Kim, Taewoo ; Choi, Seung-Hyun.. - p. 967-972 , 2023
Link: https://doi.org/10.23919..
 
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15

A Metaverse Emotion Mapping System with an AIoT Facial Expr..:

, In: 2023 IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom),
Lee, Hye-Min ; Ham, Seung-Mi ; Moon, Hansol... - p. 704-707 , 2023
Link: https://doi.org/10.1109/..
 
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