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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Multi-terminal Ultra-thin 3D Nanoporous Silicon Capacitor T..:
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2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Vertical Silicon capacitors integration within IC package f..:
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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) ,
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High performances 3D heterogeneous integrated devices based..:
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Digital Humanities and Buddhism ,
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The Digital Dictionary of Buddhism and CJKV-English Diction..:
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Dao Companion to Korean Confucian Philosophy; Dao Companions to Chinese Philosophy ,
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Philosophical Bases of the Goryeo-Joseon Confucian-Buddhist..:
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Lucien Tesnière - Syntaxe structurale et opérations mentales ,
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Lucien Tesnière et la Faculté des Lettres de Strasbourg (19..:
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Strategischer Wettbewerb im Weltraum; Sicherheit, Strategie & Innovation ,
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Abschreckung im Weltraum. Verstärkte Abschreckung durch hoc..:
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Extended Abstracts of the 2024 CHI Conference on Human Factors in Computing Systems ,
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GenAICHI 2024: Generative AI and HCI at CHI 2024:
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Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems ,
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