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Advances in Intelligent Systems and Computing; Intelligent Systems and Applications ,
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Analysis and Classification of Urinary Stones Using Deep Le..:
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2022 25th International Conference on Electrical Machines and Systems (ICEMS) ,
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A Study on the Characteristics Change According to the Type..:
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2022 IEEE 20th Biennial Conference on Electromagnetic Field Computation (CEFC) ,
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Analysis of IPMSM unbalance characteristics through 3-phase..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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A 16 GB 1024 GB/s HBM3 DRAM with On-Die Error Control Schem..:
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2023 23rd International Conference on Control, Automation and Systems (ICCAS) ,
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A Study on Analysis of Wheel Characteristics Using Amphibio..:
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2021 IEEE International Memory Workshop (IMW) ,
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Highly Reliable 28nm Embedded Flash Process Development for..:
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2017 14th International Conference on Ubiquitous Robots and Ambient Intelligence (URAI) ,
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Prototype development of underwater vehicle overcoming stro..:
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2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society ,
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The development of the friction coefficient inspection equi..:
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2022 IEEE Ninth International Conference on Communications and Electronics (ICCE) ,
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Development of DNN-based diagnostic platform for self-diagn..:
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2019 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC) ,
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Weekly Peak Load Forecasting for 104 Weeks Using Deep Learn..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Preparation of SAC305 Solder Specimens that mimic the Micro..:
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2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
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A study on the flash-light sintering characteristics with r..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Signal Integrity Analysis of IPD Decoupling Capacitor Struc..:
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2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI) ,
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Evaluating the Scattering Contribution by RCS Feature Extra..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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