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Ogata, Toshiyuki
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1

Lithographic Performance and Insulation Reliability of a No..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Inoue, Go ; Yukimori, Daiki ; Shibasaki, Kaho... - p. 44-48 , 2023
Link: https://doi.org/10.1109/..
 
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2

Novel thermosetting low Dk/Df film and its performance:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Koh, Meiten ; Yoneda, Kazuyoshi ; Nakada, Kazutaka... - p. 63-64 , 2022
Link: https://doi.org/10.23919..
 
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3

Swelling Analysis of Negative-tone Photosensitive Dielectri..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yukimori, Daiki ; Inoue, Go ; Ishikawa, Nobuhiro.. - p. 1996-2001 , 2022
Link: https://doi.org/10.1109/..
 
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4

Evaluation of the Transmission Loss of Soluble Polyphenylen..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sekiguchi, Shoya ; Oki, Kota ; Mishima, Shoko... - p. 51-55 , 2022
Link: https://doi.org/10.1109/..
 
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5

End-to-end Learning Method for Self-Driving Cars with Traje..:

, In: 2019 International Joint Conference on Neural Networks (IJCNN),
Onishi, Tadashi ; Motoyoshi, Toshiyuki ; Suga, Yuki.. - p. 1-8 , 2019
Link: https://doi.org/10.1109/..
 
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