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2024 International Conference on Electronics, Information, and Communication (ICEIC) ,
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Highly Linear Charging/Discharging of Charge Trap FET Using..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Reliability of Indium Solder Joints using a Laser-Assisted ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Chip-on-Wafer (CoW) Technology Utilizing Laser-Assisted Bon..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Laser-Assisted Bonding with Compression (LABC) based Tiling..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Anisotropic Solder Paste (ASP) Material Solution for Laser ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Micro-structure analysis of solder joint using room tempera..:
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Process Window of Mini-LED Display Panel Packaging using La..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Laser-Assisted Bonding (LAB) Process and its Bonding Materi..:
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Computational Science and Its Applications – ICCSA 2020; Lecture Notes in Computer Science ,
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Bearing Fault Detection with a Deep Light Weight CNN:
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Proceedings of the 2019 3rd International Conference on Compute and Data Analysis ,
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Convolutional Neural Network and 2-D Image Based Fault Diag..:
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2019 International Conference on Multimodal Interaction ,
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Hang Out with the Language Assistant:
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The SAGES Manual of Flexible Endoscopy ,
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Evaluation and Management of Patients with Gastroesophageal..:
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Proceedings of the 2010 Workshop on Interaction between Compilers and Computer Architecture ,
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Code size and performance optimization for mobile JavaScrip..:
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2008 IEEE Symposium on Advanced Management of Information for Globalized Enterprises (AMIGE) ,
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