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PAN, KE
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1

Adhesion Layer Influence on Thermomechanical Reliability of..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yang, Junbo ; Pan, Ke ; Yin, Pengcheng... - p. 1820-1825 , 2024
Link: https://doi.org/10.1109/..
 
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2

Fusing CNN and Transformer for Diabetic Retinopathy Image G..:

, In: Image and Graphics Technologies and Applications; Communications in Computer and Information Science,
Yao, Haitao ; Pan, Ke ; He, Lijun. - p. 399-412 , 2023
Link: https://doi.org/10.1007/..
 
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3

Efficient Multi-Scale Attention Residual Network for Breast..:

, In: Proceedings of the 2023 International Conference on Advances in Artificial Intelligence and Applications,
Cao, Lu ; Pan, Ke - p. 238-243 , 2023
Link: https://dl.acm.org/doi/1..
 
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4

The Optimal Solution of Reflow Oven Recipe based on Physics..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Lai, Yangyang ; Pan, Ke ; Ha, Jonghwan... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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5

Optimal thermo-mechanical reliability design of 2.5D lidles..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Yang, Junbo ; Cai, Chongyang ; Yin, Pengcheng... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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6

A comparative study of the thermomechanical reliability of ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Pan, Ke ; Okoro, Chukwudi ; Lai, Yangyang... - p. 1211-1217 , 2022
Link: https://doi.org/10.1109/..
 
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7

Shape Dependency of Fatigue Life in Solder Joints of Chip R..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Ha, Jonghwan ; Cai, Chongyang ; Yin, Pengcheng... - p. 1489-1494 , 2022
Link: https://doi.org/10.1109/..
 
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8

Micro- and Nanoplastic Pollution in Terrestrial Ecosystems:

, In: Advances in Toxicology and Risk Assessment of Nanomaterials and Emerging Contaminants,
Chai, Bingwen ; She, Yingzhe ; Wei, Qiang.. - p. 207-226 , 2022
Link: https://doi.org/10.1007/..
 
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9

A Deep Learning Approach for Reflow Profile Prediction:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lai, Yangyang ; Kataoka, Jun ; Pan, Ke... - p. 2269-2274 , 2022
Link: https://doi.org/10.1109/..
 
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10

Characterization of Constitutive Equation of Sn-Bi by Study..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Cai, Chongyang ; Pan, Ke ; Deo, Karthik... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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11

Parametric Study of The Geometry Design of Through-silicon ..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Pan, Ke ; Lai, Yangyang ; Xu, Jiefeng... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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12

Three-Dimensional Simulation Training System for the Instal..:

, In: Lecture Notes in Electrical Engineering; Frontier Computing,
Zhang, Ying ; Pan, Ke ; Chang, Qiang.. - p. 1701-1708 , 2020
Link: https://doi.org/10.1007/..
 
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13

Biogas Digester for Domestic Sewage Treatment:

, In: Biogas Technology,
Pan, Ke ; Shi, Guozhong ; Cheng, Jingsi - p. 69-107 , 2020
Link: https://doi.org/10.1007/..
 
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14

A Comprehensive Study of Electromigration in Lead-free Sold..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Xu, Jiefeng ; Cai, Chongyang ; Pham, Vanlai... - p. 284-289 , 2020
Link: https://doi.org/10.1109/..
 
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15

Comparative Analysis of Package Warpage Using Confocal Meth..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Cai, Chongyang ; Pan, Ke ; Yang, Junbo. - p. 945-949 , 2020
Link: https://doi.org/10.1109/..
 
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