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Pacco, Antoine
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Two-metal-level semi-damascene interconnect at metal pitch ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Gupta, Anshul ; Marti, Giulio ; Delie, Gilles... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Barrierless ALD Molybdenum for Buried Power Rail and Via-to..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Gupta, Anshul ; Maes, Jan Willem ; Jourdan, Nicolas... - p. 58-60 , 2022
Link: https://doi.org/10.1109/..
 
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