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Pan, Yu-Hsiang
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1

Exploring Multiple-Display Interaction for Live XR Performa..:

, In: ACM SIGGRAPH 2023 Posters,
Lin, Ke-Fan ; Chou, Yu-Chih ; Weng, Yu-Hsiang... - p. 1-2 , 2023
Link: https://dl.acm.org/doi/1..
 
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2

A 22nm 8Mb STT-MRAM Near-Memory-Computing Macro with 8b-Pre..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Chiu, Yen-Cheng ; Khwa, Win-San ; Li, Chung-Yuan... - p. 496-498 , 2023
Link: https://doi.org/10.1109/..
 
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3

Actualities: Seamless Live Performance with the Physical an..:

, In: ACM SIGGRAPH 2023 Immersive Pavilion,
Lin, Ke-Fan ; Chou, Yu-Chih ; Weng, Yu-Hsiang... - p. 1-2 , 2023
Link: https://dl.acm.org/doi/1..
 
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4

A 22nm 4Mb STT-MRAM Data-Encrypted Near-Memory Computation ..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Chiu, Yen-Cheng ; Yang, Chia-Sheng ; Teng, Shih-Hsin... - p. 178-180 , 2022
Link: https://doi.org/10.1109/..
 
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5

Machine Learning Hyperparameter Fine Tuning Service on Dyna..:

, In: Proceedings of the International Symposium on Big Data and Artificial Intelligence,
Peng, Yu-Hsiang ; Chuang, Chia-Chuan ; Wu, Zhou-Jin... - p. 22-28 , 2018
Link: https://dl.acm.org/doi/1..
 
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6

Determinants of Brand Loyalty in Online Brand Communities ..:

, In: Proceedings of the 5th Multidisciplinary International Social Networks Conference,
Wang, Kai ; Chen, Yu-Jen ; Pan, Hsiang-Chun - p. 1-5 , 2018
Link: https://dl.acm.org/doi/1..
 
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7

Using Higher Accelerating Voltage of SEM to Dig Out Implant..:

, In: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA),
Hsu, Wen Cheng ; Hsiang Shu, Yu ; Pan, Chenglong - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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8

NTIRE 2023 Challenge on Stereo Image Super-Resolution: Meth..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Wang, Longguang ; Guo, Yulan ; Wang, Yingqian... - p. 1346-1372 , 2023
Link: https://doi.org/10.1109/..
 
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9

NTIRE 2023 Challenge on Efficient Super-Resolution: Methods..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Li, Yawei ; Zhang, Yulun ; Timofte, Radu... - p. 1922-1960 , 2023
Link: https://doi.org/10.1109/..
 
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10

A Study of Underfill Dispensing Patterns in Flip-Chip Packa..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Chen, Dao-Long ; Chang, Hui-Jing ; Chen, Tang-Yuan... - p. 115-116 , 2023
Link: https://doi.org/10.23919..
 
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11

Efficient Deep Models for Real-Time 4K Image Super-Resoluti..:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW),
Conde, Marcos V. ; Zamfir, Eduard ; Timofte, Radu... - p. 1495-1521 , 2023
Link: https://doi.org/10.1109/..
 
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12

Photothermal nonlinearity in a graphene oxide covered silic..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Chen, Chih-Hsien ; Wu, Chang-Yi ; Cheng, Nai-Wen... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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13

FOStrip Technique for Low-Cost Fan-Out Package:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Lin, I-Hung ; Chen, Yu-Tai ; Huang, Ji-Ting... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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14

Agent Augmented Inter-Generational Crowdsourcing:

, In: 2015 IEEE/WIC/ACM International Conference on Web Intelligence and Intelligent Agent Technology (WI-IAT),
Pan, Zhengxiang ; Miao, Chunyan ; Toh Hsiang Tan, Benny.. - p. 237-238 , 2015
Link: https://doi.org/10.1109/..
 
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15

Improving Axial Resolution of Optical Resolution Photoacous..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Yu, Yu-Hsiang ; Li, Meng-Lin - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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