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2007 IEEE 34th International Conference on Plasma Science (ICOPS) ,
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Design of a High Voltage Triple Resonance Pulser:
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2007 IEEE 34th International Conference on Plasma Science (ICOPS) ,
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Compact Marx Generator for Repetitive Applications:
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2007 IEEE Symposium on VLSI Technology ,
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Novel Heat Dissipating Cell Scheme for Improving a Reset Di..:
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2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers. ,
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Highly Reliable 256Mb PRAM with Advanced Ring Contact Techn..:
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Conference Record of the Twenty-Sixth International Power Modulator Symposium, 2004 and 2004 High-Voltage Workshop. ,
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Development of a 75 Coulomb triggered vacuum switch:
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IEEE Conference Record - Abstracts. 2002 IEEE International Conference on Plasma Science (Cat. No.02CH37340) ,
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Investigation of mechanical and antibiotic effects on TiN f..:
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PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference. Digest of Papers (Cat. No.01CH37251) ,
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Spectroscopic measurement of high current vacuum arc plasma..:
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PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference. Digest of Papers (Cat. No.01CH37251) ,
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Electron beam characteristic of multi-gap pseudospark disch..:
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2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) ,
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A 56Gb/s Zero-IF D-Band Transmitter for a Beamformer in 22n..:
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Lecture Notes in Civil Engineering; Proceedings of the 3rd International Civil Engineering and Architecture Conference ,
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The Relationship Between the Surface Characteristics and Co..:
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2023 IEEE International Conference on Plasma Science (ICOPS) ,
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Study on Liquid-Vapor Two Phase Region of Copper Using Unde..:
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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
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Improving uniformity of 3-level High Aspect Ratio Supervias:
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2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) ,
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