E-LIB Suche - Ergebnisse für: Park, S D

1

The Relationship Between the Surface Characteristics and Co..:

, In: Lecture Notes in Civil Engineering; Proceedings of the 3rd International Civil Engineering and Architecture Conference,

Park, S. ; Kainuma, S. ; Ikeda, T... - p. 165-175 , 2024

Link: https://doi.org/10.1007/..

2

Improving uniformity of 3-level High Aspect Ratio Supervias:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

Montero, D. ; Marien, P. ; Hermans, Y.... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

3

Highly Manufacturable, Cost-Effective, and Monolithically S..:

, In: 2023 International Electron Devices Meeting (IEDM),

Ha, Daewon ; Lee, Wonsok ; Cho, M.H.... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

4

Low-cost construction of digital twins using administration..:

, In: Low-Cost Digital Solutions for Industrial Automation (LoDiSA 2023),

Kim, Y. -D. ; Moon, J. -H. ; Park, J. -S.... - p. None , 2023

Link: https://doi.org/10.1049/..

5

Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track S..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

Marien, P. ; Gonzalez, V. V. ; Choudhury, S.... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

6

A study on automatic fault isolation of closed loop system ..:

, In: 27th International Conference on Electricity Distribution (CIRED 2023),

Park, S. ; Park, H. ; Kang, S... - p. None , 2023

Link: https://doi.org/10.1049/..

7

A New Method for Classifying High Speed Chip Using Machine ..:

, In: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM),

Ahn, J. E. ; Choi, J. H. ; Park, J. S... - p. 0239-0243 , 2023

Link: https://doi.org/10.1109/..

8

Selective ALD Mo Deposition in 10nm Contacts:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

van der Veen, Marleen H. ; Maes, J. W. ; Pedreira, O. Varela... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

9

Study on Liquid-Vapor Two Phase Region of Copper Using Unde..:

, In: 2023 IEEE International Conference on Plasma Science (ICOPS),

Park, S. ; Lee, H. ; Chung, K.-J. - p. 1-1 , 2023

Link: https://doi.org/10.1109/..

10

Integration of a Stacked Contact MOL for Monolithic CFET:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Vega-Gonzalez, Victor ; Radisic, D. ; Chan, Bt... - p. 1-2 , 2023

Link: https://doi.org/10.23919..

11

A Holistic Methodology Toward Large-scale AI Implementation..:

, In: 2023 International Electron Devices Meeting (IEDM),

Park, S. ; Kim, J. ; Koo, W.... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

12

Why is the Winner the Best?:

, In: 2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR),

Eisenmann, M. ; Reinke, A. ; Weru, V.... - p. 19955-19966 , 2023

Link: https://doi.org/10.1109/..

13

Smart Photons from Microplasma-based UV Devices: New Opport..:

, In: 2023 IEEE International Conference on Plasma Science (ICOPS),

Park, S.-J. ; Eden, J.G. - p. 1-1 , 2023

Link: https://doi.org/10.1109/..

14

A Study of Arsenic Extraction Efficiency from Heavy Metal C..:

, In: Springer Proceedings in Earth and Environmental Sciences; Trends in Environmental Sustainability and Green Energy,

Jeon, H. ; Park, S. - p. 3-10 , 2023

Link: https://doi.org/10.1007/..

15

Low Resistance Cu Vias for 24nm Pitch and Beyond:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),

van der Veen, Marleen H. ; Pedreira, O. Varela ; Jourdan, N.... - p. 129-131 , 2022

Link: https://doi.org/10.1109/..