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Lecture Notes in Civil Engineering; Proceedings of the 3rd International Civil Engineering and Architecture Conference ,
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The Relationship Between the Surface Characteristics and Co..:
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2023 International Electron Devices Meeting (IEDM) ,
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Highly Manufacturable, Cost-Effective, and Monolithically S..:
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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
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Improving uniformity of 3-level High Aspect Ratio Supervias:
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2023 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR) ,
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Why is the Winner the Best?:
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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
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Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track S..:
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2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) ,
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Selective ALD Mo Deposition in 10nm Contacts:
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27th International Conference on Electricity Distribution (CIRED 2023) ,
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A study on automatic fault isolation of closed loop system ..:
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Low-Cost Digital Solutions for Industrial Automation (LoDiSA 2023) ,
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Low-cost construction of digital twins using administration..:
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Springer Proceedings in Earth and Environmental Sciences; Trends in Environmental Sustainability and Green Energy ,
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A Study of Arsenic Extraction Efficiency from Heavy Metal C..:
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2023 International Electron Devices Meeting (IEDM) ,
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A Holistic Methodology Toward Large-scale AI Implementation..:
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2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) ,
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A New Method for Classifying High Speed Chip Using Machine ..:
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2023 IEEE International Conference on Plasma Science (ICOPS) ,
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Smart Photons from Microplasma-based UV Devices: New Opport..:
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2023 IEEE International Conference on Plasma Science (ICOPS) ,
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Study on Liquid-Vapor Two Phase Region of Copper Using Unde..:
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2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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Integration of a Stacked Contact MOL for Monolithic CFET:
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2022 International Electron Devices Meeting (IEDM) ,
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