Peng, Yun-Ching
176  results:
Search for persons X
?
1

Multiple Device Users' Actual and Ideal Cross-Device Usage ..:

, In: Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems,
 
?
2

Contributors:

, In: Human Reproductive and Prenatal Genetics,
Aggarwal, Vimla ; Barber, T.M. ; Becker, Christian M.... - p. xiii-xix , 2023
 
?
3

Differences in Driving Performance Between Different Road E..:

, In: Proceedings of the 21st Congress of the International Ergonomics Association (IEA 2021); Lecture Notes in Networks and Systems,
Peng, Shih-Yun ; Hsu, Min-Chun ; Liu, Yung-Ching - p. 792-797 , 2021
 
?
4

Wireless Charging EEG Monitoring SoC with AI Algorithm-driv..:

, In: 2020 IEEE Asian Solid-State Circuits Conference (A-SSCC),
Liao, Zhan-Xian ; Chang, Yao-Tse ; Tsou, Chieh... - p. 1-2 , 2020
 
?
5

List of contributors:

, In: Water Security: Big Data-Driven Risk Identification, Assessment and Control of Emerging Contaminants,
Abdelkarim, Esraa A. ; Ali, Sameh S. ; Al-Tohamy, Rania... - p. xvii-xxiv , 2024
 
?
7

Power Sub-Mesh Construction in Multiple Power Domain Design..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
 
?
8

A novel and simple method of low temperature, low process t..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Huang, Jeng-Hau ; Shih, Po-Shao ; Shen, Chang-Hsien... - p. 1660-1663 , 2023
 
?
9

Low-Temperature and Pressureless Cu-to-Cu Bonding by Electr..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Shih, Po-Shao ; Huang, Jeng-Hau ; Shen, Chang-Hsien... - p. 579-584 , 2023
 
?
10

Fine-Pitch $30\ \mu \mathrm{m}$ Cu-Cu Bonding using Electro..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Yung-Sheng ; Chiang, Chun-Wei ; Hung, Yun-Ching... - p. 1115-1118 , 2023
 
?
11

Multitask Record for Badminton Match:

, In: 2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC),
Guo, Jing-Ming ; Huang, Yu-Shun ; Chang, Ting-Yu... - p. 2048-2052 , 2023
 
?
12

Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Mic..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yung-Sheng ; Hung, Yun-Ching ; Kao, Chin-Li... - p. 177-181 , 2022
 
?
 
?
14

Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Liang, Chien-Lung ; Lin, Yung-Sheng ; Kao, Chin-Li... - p. 361-366 , 2020
 
?
15

Self-similarity Student for Partial Label Histopathology Im..:

, In: Computer Vision – ECCV 2020; Lecture Notes in Computer Science,
Cheng, Hsien-Tzu ; Yeh, Chun-Fu ; Kuo, Po-Chen... - p. 117-132 , 2020
 
1-15