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2019 Electrical Design of Advanced Packaging and Systems (EDAPS) ,
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High Q-factor 3D Solenoid Inductor on InFO Package for RF S..:
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2024 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) ,
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Controlled-swap-based and Knowledge Navigated Quantum-inspi..:
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Energy Transitions and Climate Change Issues in Asia ,
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Assessing the Recreational and Educational Value of Taipei ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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A Study on the Surface Activation of Plasma Treatment for H..:
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Energy Transitions and Climate Change Issues in Asia ,
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Correction to: Assessing the Recreational and Educational V..:
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2023 20th International SoC Design Conference (ISOCC) ,
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Robust Cascaded Boost Converter with See-Saw Stress-Relief ..:
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Companion Publication of the 2023 Conference on Computer Supported Cooperative Work and Social Computing ,
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Investigating Users' Inclination of Leveraging Mobile Crowd..:
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2023 20th International SoC Design Conference (ISOCC) ,
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Integrated All-GaN Driver for High-voltage DC-DC Power Conv..:
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2023 International Conference on Fuzzy Theory and Its Applications (iFUZZY) ,
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Design of the self-optimal tuning fuzzy inference system fo..:
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2023 IEEE International Conference on Multimedia and Expo Workshops (ICMEW) ,
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Analysis of Physical Phenomena in Golf Swing:
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Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems ,
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UniCompass: Helping High School Students Find the Right Col..:
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2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
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A SSN reduction technique for single-ended I/O, parallel li..:
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Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems ,
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Point Cloud Alignment through Mid-Air Gestures on a Stereos..:
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Proceedings of the 4th International Conference on Management Science and Industrial Engineering ,
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