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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
9
Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
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MILCOM 2019 - 2019 IEEE Military Communications Conference (MILCOM) ,
13
The Case for Robust Adaptation: Autonomic Resource Manageme..:
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Proceedings of the Symposium on Simulation for Architecture & Urban Design ,
14