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Rong, L.
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1

Life Prediction of Solder Interconnects under Harsh Thermal..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Jiang, Wanyu ; Xu, Jingwen ; Wang, Jing... - p. 1-10 , 2023
Link: https://doi.org/10.1109/..
 
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2

Dissipative-based Output Regulation for Switched Systems Wi..:

, In: 2023 European Control Conference (ECC),
Li, Lili ; Rong, Di ; Wang, Bo - p. 1-6 , 2023
Link: https://doi.org/10.23919..
 
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3

A Simple Model as Design Tool for Low-Ammonia Emission Pig ..:

, In: Smart Animal Production; Technology for Environmentally Friendly Livestock Production,
Aarnink, André J. A. ; Demeyer, P. ; Rong, L. - p. 11-21 , 2023
Link: https://doi.org/10.1007/..
 
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4

Revealing ductile-to-brittle transition mechanism and enhan..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Ji, Xiaoliang ; Zhou, Wei ; An, Rong.. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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5

Prescribed-Time Time-Varying Formation Control for Multiple..:

, In: Proceedings of 2021 5th Chinese Conference on Swarm Intelligence and Cooperative Control; Lecture Notes in Electrical Engineering,
Rong, Di ; Li, Lili ; Tong, Meijuan - p. 95-104 , 2022
Link: https://doi.org/10.1007/..
 
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6

Applicability Analysis of Adaptive Power and Thermal Manage..:

, In: Man-Machine-Environment System Engineering; Lecture Notes in Electrical Engineering,
Zhang, Junhao ; Rong, A. ; Pang, Liping. - p. 397-403 , 2022
Link: https://doi.org/10.1007/..
 
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7

Effects of Extrusion Conditions on Microstructure and Age-H..:

, In: Springer Proceedings in Physics; Physics and Engineering of Metallic Materials,
Wang, Y. L. ; Jiang, H. C. ; Zhang, D.. - p. 167-181 , 2019
Link: https://doi.org/10.1007/..
 
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8

Fabrication of SiC-on-insulator substrate via a low-tempera..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Kang, Qiushi ; Wang, Chenxi ; Zhou, Shicheng... - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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9

Continuous-wave Terahertz Computed Tomography Based on Bess..:

, In: 2019 44th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz),
Rong, L. ; Li, B. ; Wang, D.... - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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10

Pressureless Low-Temperature Sintering of Silver Nano-Solde..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Wang, Te ; Wang, Chenxi ; Fang, Hui... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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11

Degradation mechanisms of solder joints on printed circuit ..:

, In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT),
Kong, Lingchao ; Zheng, Zhen ; An, Rong... - p. 911-914 , 2015
Link: https://doi.org/10.1109/..
 
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12

Study of surface metallization on 3D flexible stack package:

, In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT),
Zheng, Zhen ; Han, Ye ; Rong, An. - p. 458-461 , 2015
Link: https://doi.org/10.1109/..
 
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13

Effect of CeO2 particles on the high phosphorus electroless..:

, In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT),
Zheng, Zhen ; Rong, An ; Wei, Zhou.. - p. 476-479 , 2015
Link: https://doi.org/10.1109/..
 
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14

Effect of CeO2 particles on the low phosphorus electroless ..:

, In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT),
Zheng, Zhen ; Rong, An ; Wei, Zhou.. - p. 467-470 , 2015
Link: https://doi.org/10.1109/..
 
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15

Research on evaluation capability and mode selection of rad..:

, In: 2014 International Conference on Management Science & Engineering 21th Annual Conference Proceedings,
Di, Rong ; Xu, Ming ; Wang, Yu - p. 1753-1758 , 2014
Link: https://doi.org/10.1109/..
 
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