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Saito, Suguru
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1

Analysis of vacancies in wafer-bonding interface via positr..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Saito, Sotetsu ; Fujii, Nobutoshi ; Furuse, Shunsuke... - p. 1916-1922 , 2024
Link: https://doi.org/10.1109/..
 
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2

Elucidating the mechanism of four corner voids in chip-on-w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hirano, Takaaki ; Hiratsuka, Tatsumasa ; Yoshioka, Hirotaka... - p. 1241-1245 , 2024
Link: https://doi.org/10.1109/..
 
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3

Method to evaluate the adhesion distribution on wafers:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hiratsuka, Tatsumasa ; Hirano, Takaaki ; Kotoo, Kengo... - p. 1623-1627 , 2024
Link: https://doi.org/10.1109/..
 
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4

Determining region color by using maximum colorfulness:

, In: 2023 International Conference on Computer Graphics and Image Processing (CGIP),
Chang, Youngha ; Saito, Suguru - p. 8-12 , 2023
Link: https://doi.org/10.1109/..
 
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5

A Method for Determining the Subjective Dominant Color of a..:

, In: 2023 Nicograph International (NicoInt),
Chang, Youngha ; Saito, Suguru - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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6

Influence of H2O in bonding interfaces on bonding strength ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Yoshioka, Hirotaka ; Fujii, Nobutoshi ; Shigetoshi, Takushi... - p. 1119-1123 , 2023
Link: https://doi.org/10.1109/..
 
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7

Polygon Subdivision Control Using SVM With CSF:

, In: 2022 Nicograph International (NicoInt),
Yoshii, Naoto ; Saito, Suguru - p. 94-94 , 2022
Link: https://doi.org/10.1109/..
 
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8

Behavior of Bonding Strength on Wafer-to-Wafer Cu-Cu Hybrid..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Furuse, Shunsuke ; Fujii, Nobutoshi ; Kotoo, Kengo... - p. 591-594 , 2022
Link: https://doi.org/10.1109/..
 
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9

Distributed rendering on grid computers for multiple users ..:

, In: 2022 International Conference on Cyberworlds (CW),
Fang, Hao ; Okumura, Naohito ; Ishii, Kakeru. - p. 47-54 , 2022
Link: https://doi.org/10.1109/..
 
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10

Real-time Polygon Subdivision Control Using SVM with CSF Fi..:

, In: 2022 International Conference on Cyberworlds (CW),
Yoshii, Naoto ; Saito, Suguru - p. 55-62 , 2022
Link: https://doi.org/10.1109/..
 
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11

Decision of Line Structure beyond Junctions Using U-Net-Bas..:

, In: SIGGRAPH Asia 2021 Posters,
Ito, Ryogo ; Uchida, Mitsuhiro ; Saito, Suguru - p. 1-2 , 2021
Link: https://dl.acm.org/doi/1..
 
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12

Stylized Line Drawing of 3D Models using CNN:

, In: 2019 International Conference on Cyberworlds (CW),
Uchida, Mitsuhiro ; Saito, Suguru - p. 37-44 , 2019
Link: https://doi.org/10.1109/..
 
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13

Realistic Folded Surface Modeling from Sketching:

, In: 2019 International Conference on Cyberworlds (CW),
Zheng, Yufei ; Shi, Hatsu ; Saito, Suguru - p. 155-162 , 2019
Link: https://doi.org/10.1109/..
 
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14

Generating anime-like face images from projected 3D models:

, In: SIGGRAPH Asia 2018 Posters,
Yamakawa, Keisuke ; Saito, Suguru - p. 1-2 , 2018
Link: https://dl.acm.org/doi/1..
 
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15

Deep face rotation in the wild:

, In: Proceedings of the 24th ACM Symposium on Virtual Reality Software and Technology,
Morikawa, Shohei ; Saito, Suguru - p. 1-2 , 2018
Link: https://dl.acm.org/doi/1..
 
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