Seggern, Heinz von
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3

Printing Technologies for Integration of Electronic Devices..:

, In: Functional Nanostructures and Sensors for CBRN Defence and Environmental Safety and Security; NATO Science for Peace and Security Series C: Environmental Security,
 
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4

Modeling of piezoelectric coupling coefficients of soft fer..:

, In: 2019 IEEE International Ultrasonics Symposium (IUS),
Dali, Omar Ben ; Zhukov, Sergey ; Chadda, Romol... - p. 2454-2457 , 2019
 
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5

Organic Field-Effect Transistors for CMOS Devices:

, In: Organic Electronics; Advances in Polymer Science,
Melzer, Christian ; Seggern, Heinz von - p. 189-212 , 2009
 
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6

Generalized box model for electron irradia ted teflon foils:

, In: Conference on Electrical Insulation & Dielectric Phenomena - Annual Report 1980,
 
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7

Influence of measurement inaccuracy on the charge distribut..:

, In: Conference on Electrical Insulation & Dielectric Phenomena - Annual Report 1978,
von Seggern, Heinz - p. 12-17 , 1978
 
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9

Thermally stimulated decay of negatively charged Teflon - F..:

, In: Conference on Electrical Insulation & Dielectric Phenomena - Annual Report 1980,
Seggern, Heinz V. - p. 345-352 , 1980
 
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