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Sell, K
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1

Concept for printed ferroelectric sensors on coated metalli..:

, In: 2016 IEEE SENSORS,
Enser, Herbert ; Sell, J.K. ; Krause, M.... - p. 1-3 , 2016
Link: https://doi.org/10.1109/..
 
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2

Shaping Attacker Behavior: Evaluation of an Enhanced Cyber ..:

, In: HCI for Cybersecurity, Privacy and Trust; Lecture Notes in Computer Science,
McKneely, Jennifer A. B. ; Sell, Tara K. ; Straub, Kathleen A... - p. 358-379 , 2022
Link: https://doi.org/10.1007/..
 
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3

Intellectual Property and the Creation of Global Rules:

, In: The New Legal Realism,
Sell, Susan K. - p. 52-66 , 2016
Link: https://doi.org/10.1017/..
 
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4

Perspectives on Backside Power (PowerVia):

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Shamanna, M. ; Fischer, K. ; Hafez, W.... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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5

Tuberculosis: Integrated Studies for a Complex Disease 2050:

, In: Integrated Science; Tuberculosis,
Rezaei, Nima ; Hosseini, Nastaran-Sadat ; Saghazadeh, Amene... - p. 1063-1098 , 2023
Link: https://doi.org/10.1007/..
 
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6

E-Core Implementation in Intel 4 with PowerVia (Backside Po..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Shamanna, M. ; Abuayob, E. ; Aenuganti, G.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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7

Intel PowerVia Technology: Backside Power Delivery for High..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hafez, W. ; Agnihotri, P. ; Asoro, M.... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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8

Intel 4 CMOS Technology Featuring Advanced FinFET Transisto..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Sell, B. ; An, S. ; Armstrong, J.... - p. 282-283 , 2022
Link: https://doi.org/10.1109/..
 
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9

A 32A 5V-Input, 94.2% Peak Efficiency High-Frequency Power ..:

, In: 2021 Symposium on VLSI Circuits,
Desai, Nachiket ; Krishnamurthy, Harish K. ; Lambert, William... - p. 1-2 , 2021
Link: https://doi.org/10.23919..
 
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10

2 MB Array-Level Demonstration of STT-MRAM Process and Perf..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),
Alzate, J.G. ; Hentges, P. ; Jahan, R.... - p. 2.4.1-2.4.4 , 2019
Link: https://doi.org/10.1109/..
 
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11

List of contributors:

, In: Electrospun Materials for Tissue Engineering and Biomedical Applications,
Albuquerque, M.T.P. ; Balusamy, B. ; Berezkinová, L.... - p. xi-xiii , 2017
Link: https://doi.org/10.1016/..
 
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12

Electrospun biomaterials for dermal regeneration:

, In: Electrospun Materials for Tissue Engineering and Biomedical Applications,
Growney Kalaf, E.A. ; Hixon, K.R. ; Kadakia, P.U... - p. 179-231 , 2017
Link: https://doi.org/10.1016/..
 
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13

Contributors:

, In: Laboratory Experiments in the Social Sciences,
Berger, Joseph ; Devetag, Giovanna ; Driskell, James E.... - p. xvii-xviii , 2014
Link: https://doi.org/10.1016/..
 
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14

Electrospinning and its influence on the structure of polym..:

, In: Handbook of Textile Fibre Structure,
Garg, K. ; Sell, S.A. ; Bowlin, G.L. - p. 460-483 , 2009
Link: https://doi.org/10.1533/..
 
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15

An advanced low power, high performance, strained channel 6..:

, In: IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.,
Tyagi, S. ; Kenyon, C. ; Lee, S.-H.... - p. 245-247 , 2005
Link: https://doi.org/10.1109/..
 
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