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Seo, Min-Jae
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1

A Hardware-efficient Rate Encoding Hardware with Latch-base..:

, In: 2024 International Conference on Electronics, Information, and Communication (ICEIC),
Jo, Sun-A ; Seo, Ji-won ; Seo, Min-jae - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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2

An 81.2dB-SNDR Dual-Residue Pipeline ADC with a 2nd- Order ..:

, In: 2023 IEEE Custom Integrated Circuits Conference (CICC),
Chung, Jae-Hyun ; Kim, Ye-Dam ; Park, Chang-Un... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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3

A 10 nV/rt Hz noise level 32-channel neural impedance sensi..:

, In: 2020 42nd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC),
Kim, Jong Pal ; Lee, Wonseok ; Suh, Junyeub... - p. 4012-4015 , 2020
Link: https://doi.org/10.1109/..
 
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4

A Single-Supply Buffer-Embedding SAR ADC with Skip-Reset ha..:

, In: 2019 IEEE Asian Solid-State Circuits Conference (A-SSCC),
Seo, Min-Jae ; Jin, Dong-Hwan ; Kim, Ye-Dam... - p. 189-192 , 2019
Link: https://doi.org/10.1109/..
 
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5

5.5 A 2.1e− Temporal Noise and −105dB Parasitic Light Sensi..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Lee, Jae-Kyu ; Kim, Seung Sik ; Baek, In-Gyu... - p. 102-104 , 2020
Link: https://doi.org/10.1109/..
 
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6

Maximizing Percolation Effect using Sub-100 nm Nano-Valley ..:

, In: 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS),
Yoo, Jae-Young ; Seo, Min-Ho ; Lee, Jae-Shin... - p. 91-94 , 2019
Link: https://doi.org/10.1109/..
 
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7

Eutectic Bonding in Sequential Bi and Sn Layers for Low-Tem..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Rajendran, Sri Harini ; Jung, Jae Pil ; Jung, Chul Hwa. - p. 277-278 , 2024
Link: https://doi.org/10.23919..
 
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8

A Time-Memory-based CMOS Vision Sensor with In-Pixel Tempor..:

, In: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),
Jee, Dong-Woo ; Ko, Seong-Min ; Kasichainula, Kishore... - p. 109-112 , 2023
Link: https://doi.org/10.1109/..
 
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9

Analysis of Virtual Reality Movies: Focusing on the Effect ..:

, In: Communications in Computer and Information Science; HCI International 2023 Posters,
Seo, Soo-Min ; Kimm, Min-Jae - p. 308-312 , 2023
Link: https://doi.org/10.1007/..
 
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10

Ultrasonic dispersion of nanocomposite solder for microelec..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Rajendran, Sri Harini ; Kang, Hyejun ; Seo, Seong Min. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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11

Analysis and Differential Expression of Primo Genes Using R..:

, In: Advances in Experimental Medicine and Biology; Oxygen Transport to Tissue XLI,
Shin, Jun-Young ; Ji, Jong-Ok ; Choi, Sang-Heon... - p. 393-399 , 2020
Link: https://doi.org/10.1007/..
 
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12

Magnesium Process and Alloy Development for Applications in..:

, In: The Minerals, Metals & Materials Series; Magnesium Technology 2019,
Klaumünzer, David ; Hernandez, Jose Victoria ; Yi, Sangbong... - p. 15-20 , 2019
Link: https://doi.org/10.1007/..
 
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13

Classifying and Mapping Groundwater Level Variations Using ..:

, In: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium,
Yu, Su Min ; Young Seo, Jae ; Kim, Bo Ram. - p. 3755-3757 , 2023
Link: https://doi.org/10.1109/..
 
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14

Development of In-Vehicle Evaluation System for Steering As..:

, In: 2023 IEEE 15th International Conference on Humanoid, Nanotechnology, Information Technology, Communication and Control, Environment, and Management (HNICEM),
Kim, Eunwoo ; Han, Jihye ; Kim, Hakmin... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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15

A Metaverse Emotion Mapping System with an AIoT Facial Expr..:

, In: 2023 IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom),
Lee, Hye-Min ; Ham, Seung-Mi ; Moon, Hansol... - p. 704-707 , 2023
Link: https://doi.org/10.1109/..
 
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