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2024 IEEE First International Conference on Artificial Intelligence for Medicine, Health and Care (AIMHC) ,
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Prediction of BPSD Using Environmental and Vital Sensor Dat:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
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Imprint-Through Mold Via (i-TMV) with Highly-Effective Elec..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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"Molded-package-last" Process for Fan-out System in Package..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Imprint-Through Mold Via (i-TMV) with High Aspect Ratio and..:
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2019 IEEE Asia-Pacific Microwave Conference (APMC) ,
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