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Shie, Chuen-Kai
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1

Representation Learning on Large and Small Data:

, In: Big Data Analytics for Large-Scale Multimedia Search,
Chou, Chun-Nan ; Shie, Chuen-Kai ; Chang, Fu-Chieh.. - p. 1-28 , 2019
Link: https://doi.org/10.1002/..
 
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2

Freehand Push-Gesture Recognition via 3D Palm Trajectory Mo..:

, In: Proceedings of the Third International Symposium of Chinese CHI,
Lin, Shih-Yao ; Shie, Chuen-Kai ; Chen, Chu-Song. - p. 37-41 , 2015
Link: https://dl.acm.org/doi/1..
 
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3

AirTouch panel : a re-anchorable virtual touch panel:

, In: Proceedings of the 21st ACM international conference on Multimedia,
Lin, Shih-Yao ; Shie, Chuen-Kai ; Chen, Shen-Chi. - p. 625-628 , 2013
Link: https://dl.acm.org/doi/1..
 
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4

Action recognition for human-marionette interaction:

, In: Proceedings of the 20th ACM international conference on Multimedia,
Lin, Shih-Yao ; Shie, Chuen-Kai ; Chen, Shen-Chi. - p. 39-48 , 2012
Link: https://dl.acm.org/doi/1..
 
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5

Low Contact Resistance and Low Temperature Hybrid Bonding w..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
He, Pin-Syuan ; Shie, Kai-Cheng ; Chen, Chih - p. 321-323 , 2023
Link: https://doi.org/10.1109/..
 
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6

Modeling of Cu-Cu Thermal Compression Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Shie, Kai-Cheng ; Tran, Dinh-Phuc ; Gusak, A. M.... - p. 2201-2205 , 2022
Link: https://doi.org/10.1109/..
 
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7

Reliability of Instant Bonding of Cu-Cu joints: Thermal Cyc..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Shie, Kai-Cheng ; Hsu, Po-Ning ; Li, Yu-Jin.. - p. 91-94 , 2020
Link: https://doi.org/10.1109/..
 
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8

Electromigration in 2 μm Redistribution Lines and Cu-Cu Bon..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Tseng, I-Hsin ; Shie, Kai-cheng ; Tzu-Hung Lin, Benson.. - p. 479-484 , 2020
Link: https://doi.org/10.1109/..
 
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9

Study of Electromigration of Solder Microbumps by 3D X-ray ..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lin, Tzu-Wen ; Shie, Kai-Cheng ; Chen, Chih. - p. 76-78 , 2020
Link: https://doi.org/10.1109/..
 
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10

Supplement of iron abrogates SARS-CoV-2 pseudovirus infecti..:

, In: 2022 IEEE 22nd International Conference on Bioinformatics and Bioengineering (BIBE),
Shih, Yu-Yin ; Lin, Chun-Hung ; Liu, Kuan-Ting... - p. 134-136 , 2022
Link: https://doi.org/10.1109/..
 
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