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Shih, Chih-yu
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1

9 Ethnic Economy of Citizenship in China: Four Approaches t..:

, In: Changing Meanings of Citizenship in Modern China,
Shih, Chih-Yu - p. 232-254 , 2002
Link: https://doi.org/10.4159/..
 
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2

High Speed Signal Design on Fan-Out RDL Interposer for Arti..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhuang, Ming-Han ; Shih, Chih-Yuan ; Lin, Ho-Chuan.. - p. 275-276 , 2024
Link: https://doi.org/10.23919..
 
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3

Machine Learning in Integrated Circuit Substrate Electrical..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lai, Jung-Pin ; Lin, Ying-Lei ; Liu, Yu-Hui... - p. 178-182 , 2023
Link: https://doi.org/10.1109/..
 
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4

Interfacial Microstructure Evolution of Low Melting Point A..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Chen, Cheng-Lun ; Hung, Liang-Yih ; Lee, Yueh Yang.. - p. 102-105 , 2023
Link: https://doi.org/10.1109/..
 
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5

Telehealth Data-derived Visual Analytics for Health Informa..:

, In: 2022 IEEE Biomedical Circuits and Systems Conference (BioCAS),
Chen, Chih-Yuan ; Huang, Hsin-Hung ; Wu, Chiu-Yeh... - p. 444-447 , 2022
Link: https://doi.org/10.1109/..
 
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6

Zero-tuning Grinding Process Methodology of Cyber-Physical ..:

, In: 2020 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS),
Yang, Hsuan-Yu ; Shih, Chih-Hsuan ; Lo, Yuan-Chieh. - p. 4270-4275 , 2020
Link: https://doi.org/10.1109/..
 
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7

Key Ingredients for Improving Process Quality at High-Level..:

, In: 2020 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM),
Shih, Chih-Hsuan ; Lo, Yuan-Chieh ; Yang, Hsuan-Yu. - p. 1184-1189 , 2020
Link: https://doi.org/10.1109/..
 
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8

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
Link: https://doi.org/10.1109/..
 
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9

Dual Constant Voltage Mode Control for Resonant Current Red..:

, In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia),
Pamungkas, Laskar ; Shih, Bo-Chih ; Chang, Yu-Chen. - p. 1767-1772 , 2023
Link: https://doi.org/10.23919..
 
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10

Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liao, Po Yu ; Ho, Ian ; Lai, David... - p. 182-186 , 2022
Link: https://doi.org/10.1109/..
 
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11

Chronic Kidney Disease Stage Classification Using Renal Art..:

, In: 2019 IEEE International Conference on Systems, Man and Cybernetics (SMC),
Gochoo, Munkhjargal ; Hsieh, Jun-Wei ; Lee, Chien-Hung.. - p. 2502-2505 , 2019
Link: https://doi.org/10.1109/..
 
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12

High Speed SerDes Design on Flip Chip Package Substrate:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Zhuang, Ming-Han ; Lai, Chia-Chu ; Lin, Ho-Chuan... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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13

Value assignment of Adjustable Delay Buffers for clock skew..:

, In: Proceedings of the 2009 International Conference on Computer-Aided Design,
Su, Yu-Shih ; Hon, Wing-Kai ; Yang, Cheng-Chih.. - p. 535-538 , 2009
Link: https://dl.acm.org/doi/1..
 
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14

Transmission Scheduling for Solar-Powered Wireless Monitori..:

, In: 2022 IEEE International Conference on Consumer Electronics (ICCE),
Chien, Ya-Ju ; Chen, Yi-Ting ; Yu, Shih-Cheng.. - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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15

Personalized Mobile Learning System via Smart Glasses:

, In: Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; IoT as a Service,
Tsai, Yi-Ting ; Yu, Shih-Jou ; Chen, Xin-Yen... - p. 136-144 , 2018
Link: https://doi.org/10.1007/..
 
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